A laminating device for attaching a curved cover plate with an irregular shape to a flexible screen includes a pressing flat body, two laminating sheets and two laminating sheet rolling wheels. The pressing flat body having a pressing flat wall to carry the flexible screen, to attached the flexible screen to a portion of the flat area of the curved cover plate with the irregular shape. The two laminating sheets are arranged on opposite sides of the pressing flat body. A first end of each of the laminating sheets is attached to the pressing flat body, and a second end of each of the laminating sheets opposite to the first end is curlable towards the pressing flat body. The two laminating sheet rolling wheels are corresponding to the two laminating sheets. Each of the laminating sheet rolling wheels moves on the curved cover plate with the irregular shape, respectively.

A method for manufacturing a thermal transfer from a high-loft substrate such as velvet. The method begins with a high-loft material sheet. The sheet is registered in a vacuum press, and a vacuum is applied to one side. A sublimation graphic is printed onto an opposing side of the high-loft material sheet. Next, an adhesive layer is laminated onto the opposing side of the printed sheet. The sheet is optionally laser-etched on the printed side, and is laser-cut into a desired shape. A protective release sheet is applied over the printed graphic. The method makes it possible to sublimation-print the transfer onto high-loft fabric such as velvet and yet still retain fine graphical registration and detail.

A membrane bearing device, a membrane attaching apparatus and a method for attaching a membrane are provided in embodiments of the disclosure. The membrane bearing device includes: a base plate, comprising a first bearing surface configured to bear a membrane; and a roller, which is rotatably mounted onto the base plate, and is configured to transfer and attach the membrane from the first bearing surface to a substrate onto which the membrane is to be attached, by rolling on the membrane.

The present invention relates to a method and apparatus for forming a composite structure, preferably for use in an absorbent structure used within the personal hygiene industry, such as for instance feminine hygiene garments, baby diapers and pants and adult incontinence garments. The present invention preferably provides a method and apparatus for depositing and positioning particulate materials in a desired pattern onto a moving carrier layer. The method allows accurate forming of a pattern of particulate material clusters at high production speed having improved attachment properties, with reduced raw material usage and relative low cost. The present invention foresees in the need for improved thin, flexible, lightweight absorbent structure having optimal absorption, distribution and retention.

A glass panel unit includes: a first panel; a second panel facing the first panel; a sealing member bonded to respective facing peripheral portions of the first panel and the second panel; and at least one spacer provided in a reduced pressure space between the first panel and the second panel. The at least one spacer includes a resin body and at least one ultraviolet protective layer provided on a surface of the resin body.

The methods herein relate to assembling an elastic laminate with a first elastic material and a second elastic material bonded between first and second substrates. During assembly, an elastic laminate may be formed by positioning the first and second substrates in contact with stretched central regions of the first and second elastic materials. The elastic laminates may include two or more bonding regions that may be defined by the various layers or components of the elastic laminate that are laminated or stacked relative to each other. In some configurations, a first plurality of ultrasonic bonds are applied to the elastic laminate to define a first bond density in the first bonding region, and a second plurality of ultrasonic bonds are applied to the elastic laminate to define a second bond density in the second bonding region, wherein the second bond density is not equal to the first bond density.

Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised positon in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.

An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

A release film of a protective module for manufacturing a display device, includes a film layer including a first surface facing a protective panel which is attachable to a display panel of the display device, and a second surface opposite to the first surface; an embossed pattern layer protruding from the second surface of the film layer; and the embossed pattern layer including a plurality of intaglio portions arranged along the film layer.