The present disclosure relates to methods for assembling elastic laminates that may be used to make absorbent article components. Particular aspects of the present disclosure involve providing a first substrate and a second substrate, the first substrate and the second substrate, each having a width in a cross direction; providing an activated elastic material; elongating the activated elastic material; and ultrasonically bonding the first substrate together with the second substrate with the elongated activated elastic material positioned between the first substrate and the second substrate.

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

Pulpless absorbent cores and methods of manufacture are disclosed. A method of forming a pulpless absorbent core may comprise moving a foraminous forming surface having un-masked portions and masked portions in a machine direction, the un-masked portions defining an absorbent core region. The method may further comprise depositing particulate material at a velocity of less than 1200 meters per minute in the absorbent core region while applying a vacuum. The absorbent core region may comprise: a front core region spanning a first half of the absorbent core region and a rear core region spanning a second half, wherein the front core region trails the rear core region in the machine direction, and the masked portions of the foraminous forming surface block airflow through the forming surface to cause greater than 60% of the particulate material deposited in the absorbent core region to locate in the front core region.

The present disclosure relates to methods for assembling elastic laminates that may be used to make absorbent article components. Particular aspects of the present disclosure involve a spreader mechanism operating to activate an elastic material by stretching the elastic material in to a first elongation. The elastic material is then consolidated to a second elongation, wherein the second the elongation is less than the first elongation. The consolidated elastic material is then joined to one or more substrates. In some configurations, the substrates may be nonwovens, and the elastic material may be an elastic film and/or an elastic laminate.

Pulpless absorbent cores and methods of manufacture are disclosed. A method of forming a pulpless absorbent core may comprise moving a foraminous forming surface having un-masked portions and masked portions in a machine direction, the un-masked portions defining an absorbent core region. The method may further comprise depositing particulate material at a velocity of less than 1200 meters per minute in the absorbent core region while applying a vacuum. The absorbent core region may comprise: a front core region spanning a first half of the absorbent core region and a rear core region spanning a second half, wherein the front core region trails the rear core region in the machine direction, and the masked portions of the foraminous forming surface block airflow through the forming surface to cause greater than 60% of the particulate material deposited in the absorbent core region to locate in the front core region.

A high-speed lamination machine includes a hinged, clamshell lid, and clamped lamination chamber that uses localized and thermally isolated heating and stepper driven separation pin motion. Pneumatically actuated rollers in a track clamp the lamination chamber closed during operation. The clamshell design obviates the need for a hydraulic press and makes the lamination chamber easily accessible to other automated systems, so robots may be used to place lamination elements within the chamber.

Techniques for modifying surfaces of electrodes are provided. An electrode surface can be processed by applying an abrasive material or chemical solution to or against the surface to modify the surface to reduce the amount of roughness on, and/or alter the shape of, the surface. The shape of the surface can be altered by rounding or doming the surface. During surface processing, flexible or compressible support material can be applied to the back of an abrasive material, such as sandpaper, to desirably distribute pressure from the support material to the sandpaper and/or mold the shape of the sandpaper to facilitate maintaining desirable contact by the sandpaper on electrode surfaces. With regard to a flexible circuit board on which electrodes are formed, a vacuum chuck component or a temporary abrasive can be used to hold the circuit board in a flat and stationary position during surface processing.

According to one embodiment, there is provided a substrate bonding apparatus including a first suction stage, a second suction stage, and a pressing member. The first suction stage sucks a first substrate. The second suction stage is arranged so as to face the first substrate. The second suction stage sucks the second substrate. The pressing member is capable of deforming the first substrate sucked on the first suction stage so as to be convex toward the second suction stage side. The pressing member has a marking structure on a distal end side.

A system for laminating and/or de-bubbling mobile electronic device screens, comprises a machine unit comprising a metal vacuum pressure chamber with lid, safety sensors and o-ring; an internal or external vacuum pump; a piston chamber, piston and piston plate; a central air distribution block with solenoid valves and pressure sensor; a control PCB (printed circuit board) with processor and operating software system for controlling the machine unit; actuators; an on/off power switch; a power inlet; an operations button; an air inlet port and an external air compressor.

A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.