The present disclosure relates to methods and apparatuses for assembling elastic laminates that may be used to make absorbent article components. Particular aspects of the present disclosure include providing a first substrate and a second substrate, the first substrate and the second substrate, each having a width in a cross direction; providing an elastic material; elongating the activated elastic material using a spreader mechanism; and ultrasonically bonding the first substrate together with the second substrate with the elongated activated elastic material positioned between the first substrate and the second substrate using an anvil and an ultrasonic device.

A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

A bonding device and a bonding method for an irregular-shaped curved cover plate and a flexible screen are disclosed. The bonding device includes: a support body supporting the flexible screen; and a bonding body supporting the flexible screen together with the support body and pressing the flexible screen. The bonding body has a cylindrical shape. A cross-sectional shape of the bonding body along an axial direction matches with a cross-sectional shape of the irregular-shaped curved cover plate. The support body is located at a radial end of the bonding body. The bonding body can be expanded along the axial direction, to have opposite sides thereof abutted against the arc hook areas.

Provided are a wafer bonding apparatus for accurately detecting a bonding state of wafers in a wafer bonding process and/or in a wafer bonding system including the wafer bonding apparatus. The wafer bonding apparatus includes a first supporting plate including a first surface and vacuum grooves for vacuum-absorption of a first wafer disposed on the first surface, a second supporting plate including a second surface facing the first surface. A second wafer is on the second surface. The wafer bonding apparatus and/or the wafer bonding system include a bonding initiator at a center portion of the first supporting plate, and an area sensor on the first supporting plate and configured to detect a propagation state of bonding between the first wafer and the second wafer.

Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

Methods, apparatuses, and systems are disclosed for manufacturing a structure having layers that may operate in low pressure or vacuum environments. More particularly, methods, apparatuses, and systems are disclosed for minimizing the effects of voids by eliminating their contents in layers of bonded structures. In some implementations, a method for improving bonding within a layered structure comprises applying a bonding material layer to a substrate layer; disposing a wicking material in the bonding material layer, said wicking material having an outer surface; applying a surface material layer to the bonding material layer to form a layered structure; and curing the layered structure.

A device for picking up, shaping, and placing a thin glass pane, includes a frame with an upper side and a lower side, which is suitable to be directed at a glass pane with a thickness of less than 1 mm, and which is provided with a plurality of picking up pins that are arranged substantially parallel to one another and whose end directed at the glass pane is equipped with a suction cup, wherein the picking up pins are movable along their direction of extension independent of one another in order to adapt the arrangement of the suction cups to an intended shape of the glass pane.

The invention relates to a method for continuously manufacturing elastic pants (28), wherein a flat web material (1, 16, 19) is continuously conveyed in a longitudinal direction (8) of the web material (1, 16, 19), is shaped into a closed tube (4), and is closed in the longitudinal direction (8). The closed tube (4) forms a first outer layer (9). Elastic threads (10) in the form of a tubular reinforcement are then wound around the first outer layer (9) in the conveying direction (8) in such a way that the elastic threads (10) are taut when the outer layer (9) has a convex shape. A second outer layer (15) is then continuously applied to the elastic threads (10) in the conveying direction (8) and is joined to the elastic threads (10) and/or the first outer layer (9). The first outer layer (9), the elastic threads (10) and the second outer layer (15) form an elastic pants web material (21). Further down in the conveying direction (8), the pants web material (21) is closed along a joining section (29) in regular intervals such that the joining section (29) forms two approximately equally large opening sections that lie opposite each other in the transverse direction. Further down in the conveying direction (8), the pants web material (21) is cut at a distance from the joining section (29) such that a pair of elastic pants (28) is formed.

A system for ultrasonic bonding of elastic includes a rotating roll. The rotating roll has an exterior surface. A removable shell layer is attached to the external surface. The removable shell layer includes one or more patterned segments. The patterned segments include a shell channels formed through the removable shell layer to form a pattern.

The present disclosure relates to assembling elastic laminates that may be used to make absorbent article components. Methods herein may include an anvil adapted to rotate about an axis of rotation, wherein first and second spreader mechanisms adjacent the anvil roll are axially and angularly displaced from each other with respect to the axis of rotation. During the assembly process, a substrate may be advanced in a machine direction onto the rotating anvil. The first spreader mechanism stretches a first elastic material in the cross direction, and the second spreader mechanism stretches a second elastic material in the cross direction. The stretched first and second elastic materials advance from the spreader mechanisms and onto the substrate on the anvil roll. The combined and elastic materials may then be ultrasonically bonded together on the anvil to form at least one elastic laminate.