Patent classifications
A61N1/16
Method and apparatus for improvement of microcirculation
An apparatus and method for improving microcirculation by suppressing and cancelling the negative effects of electromagnetic radiation from cellular phones and computers connected to wireless networks on microcirculation. The apparatus generates frequencies that are synchronized and in opposed amplitudes to the detected electromagnetic radiation frequencies, thereby suppressing and cancelling the negative effects of the electromagnetic radiation frequencies on microcirculation.
Method and apparatus for improvement of microcirculation
An apparatus and method for improving microcirculation by suppressing and cancelling the negative effects of electromagnetic radiation from cellular phones and computers connected to wireless networks on microcirculation. The apparatus generates frequencies that are synchronized and in opposed amplitudes to the detected electromagnetic radiation frequencies, thereby suppressing and cancelling the negative effects of the electromagnetic radiation frequencies on microcirculation.
CONDUCTIVE FILM AND ELECTROMAGNETIC WAVE SHIELDING MATERIAL USING SAME
One aspect of the present invention relates to a conductive film including: a thermosetting resin layer; and a conductive layer on at least a part of at least one surface of the thermosetting resin layer, in which the thermosetting resin layer has an elongation at break at 20 C. of 50% or more, a tensile modulus at 20 C. of 1.0 MPa or more and 200 MPa or less, and a storage modulus at 250 C. of 0.1 MPa or more and 200 MPa or less, a film thickness of the conductive layer is 0.1 m or more and 3.0 m or less, the conductive layer contains a metal complex, and the conductive layer has a surface resistivity of 110.sup.2/ or more and 10 / or less.
CONDUCTIVE FILM AND ELECTROMAGNETIC WAVE SHIELDING MATERIAL USING SAME
One aspect of the present invention relates to a conductive film including: a thermosetting resin layer; and a conductive layer on at least a part of at least one surface of the thermosetting resin layer, in which the thermosetting resin layer has an elongation at break at 20 C. of 50% or more, a tensile modulus at 20 C. of 1.0 MPa or more and 200 MPa or less, and a storage modulus at 250 C. of 0.1 MPa or more and 200 MPa or less, a film thickness of the conductive layer is 0.1 m or more and 3.0 m or less, the conductive layer contains a metal complex, and the conductive layer has a surface resistivity of 110.sup.2/ or more and 10 / or less.
Energy stimulation device provided with a stimulation transmitter
An energy stimulation device having at least one stimulation generator provided with at least one first metal body and at least one the second metal body in contact with the first metal body. The first metal body and the second metal body are different metals. The device also includes at least one stimulation transmitter, the stimulation transmitter having a rigid support separate from the stimulation generator, and the stimulation generator being fixed on the rigid support. The energy stimulation device is applicable to bio-stimulation for therapeutic and non-therapeutic purposes.
Energy stimulation device provided with a stimulation transmitter
An energy stimulation device having at least one stimulation generator provided with at least one first metal body and at least one the second metal body in contact with the first metal body. The first metal body and the second metal body are different metals. The device also includes at least one stimulation transmitter, the stimulation transmitter having a rigid support separate from the stimulation generator, and the stimulation generator being fixed on the rigid support. The energy stimulation device is applicable to bio-stimulation for therapeutic and non-therapeutic purposes.
Radiation-free heating pad and processing technology thereof
A radiation-free heating pad and a processing technology thereof is provided. The radiation-free heating pad includes heating wires, a fiber layer, a flexible shielding layer, and a reinforcement layer. The heating wires are uniformly arranged on the fiber layer in a serpentine pattern, a layer of aluminum foil is arranged on each of an upper side and a lower side of the fiber layer, and the aluminum foil tightly wraps the heating wire. The flexible shielding layer is arranged outside the aluminum foil, and the reinforcement layer is arranged outside the flexible shielding layer. The radiation-free heating pad is based on the Faraday cage effect, and an electromagnetic field generated when an electric current passes through the heating wire can be effectively counteracted by a double shielding structure composed of the aluminum foil and the flexible shielding layer.
Radiation-free heating pad and processing technology thereof
A radiation-free heating pad and a processing technology thereof is provided. The radiation-free heating pad includes heating wires, a fiber layer, a flexible shielding layer, and a reinforcement layer. The heating wires are uniformly arranged on the fiber layer in a serpentine pattern, a layer of aluminum foil is arranged on each of an upper side and a lower side of the fiber layer, and the aluminum foil tightly wraps the heating wire. The flexible shielding layer is arranged outside the aluminum foil, and the reinforcement layer is arranged outside the flexible shielding layer. The radiation-free heating pad is based on the Faraday cage effect, and an electromagnetic field generated when an electric current passes through the heating wire can be effectively counteracted by a double shielding structure composed of the aluminum foil and the flexible shielding layer.