A composite cooling film comprises an anti soiling layer of fluorinated organic polymeric material and a reflective metal layer that is disposed inwardly of the anti soiling layer, wherein the antisoiling layer comprises a first, outwardly-facing, exposed antisoiling surface and a second, inwardly-facing opposing surface.

A recyclable flexible laminate for use in a packaging structure, and method of manufacture, comprising a first structure having an inner surface and an outer surface. The first structure comprises machine-direction oriented polyethylene or biaxially oriented polyethylene. The laminate also comprises a second structure having an inner surface and an outer surface, wherein the second structure is machine-direction oriented polyethylene or biaxially oriented polyethylene. The first structure and the second structure are adhesively laminated together using an adhesive.

A layer includes polyvinyl alcohol and 20 wt % or more calcium carbonate, based on the total weight of the layer. Another layer includes polyvinyl alcohol and calcium carbonate. A container includes a body that defines an internal cavity capable of holding an article, the body including a layer including polyvinyl alcohol and 20 wt % or more of calcium carbonate, based on the total weight of the layer. Another container includes a layer including polyvinyl alcohol and calcium carbonate.

The invention relates to inner covering for containers, the objective of which is to reduce the impact of temperatures on the inside thereof and to protect against the moisture known as “container rain”. The covering is formed by a rectangular prismatic case (1) in the horizontal position, made from a laminated composite having several layers, with two smaller bases and a series of bars (4) arranged in fixing elements (3) corresponding to two or more edges of the smaller bases, characterized in that the bars (4) are formed by elements that can be inserted into one another.

A resin sheet is provided having low dielectric properties, and a circuit board material using such a sheet. The resin sheet includes a resin layer containing a cyclic polyolefin resin copolymer having a crystal melting peak temperature of less than 100° C., the resin sheet having a dielectric loss tangent at 12 GHz of less than 0.005.

A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.

To provide a laminate which has a heat sealing property, a barrier property and mechanical strength, of which elution of impurities from the surface to be in contact with a chemical solution is suppressed, and of which peeling and the like hardly occur at the sealed portion of a bag and at the interfaces between the layers of the laminate when exposed to high temperature, a bag using it and a lithium ion battery. A laminate 10 comprising a first layer 12 containing a fluororesin, a second layer 14 containing a barrier material, a third layer 16 containing a fluororesin and a fourth layer 18 containing a polyamide in this order, wherein each of the fluororesin in the first layer 12 and the fluororesin in the third layer 16 is a fluororesin having a melting point of from 160 to 230° C. and having adhesive functional groups.

Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

An object of the present invention is to provide a moisture barrier laminate including a moisture trapping layer that maximizes its moisture trapping performance and exhibits an excellent moisture barrier property. The moisture barrier laminate of the present invention includes a gas barrier film substrate A having a gas barrier layer a1 and a moisture trapping layer B formed on the film substrate A as a base. On a surface of the moisture trapping layer B opposite to the film substrate A, a protective resin layer C having a moisture permeability in a range of 4.0×10 to 5.0×10.sup.4 g/m.sup.2.Math.day at 40° C. and 90% RH is laminated.

A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.