A laminated glass provided in an automobile door panel including two panel boards facing each other and seal members provided on facing surfaces of the panel boards at regions along a beltline, the laminated glass being openable and closable by being provided between the two panel boards so as to slide between the seal members, the laminated glass includes: a laminated glass main body including at least two glass plates and an interlayer film sandwiched between the glass plates and having a storage modulus G of 1.5×10.sup.6 Pa or more; and a viscoelastic member provided on a surface of the laminated glass main body, the viscoelastic member abutting on the seal member or the panel board and sealing a gap between the seal member or the panel board and the laminated glass main body, at a closed time of the laminated glass.

Disclosed are: a polyalkylene terephthalate resin composition comprising (A) a polyalkylene terephthalate resin and (B) an acrylic-based core-shell polymer which has an average particle size of 2 μm or greater and in which an amount of the core layer component is more than 80% by mass but less than 100% by mass relative to a total mass of the core layer component and a shell layer component; and a molded article which is obtained by molding the polyalkylene terephthalate resin composition.

A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Described herein is an stain and sag resistant acoustic building panel comprising a porous body formed from building material and latex binder, wherein the building material may include fibers and filler and at one of the building materials has been pre-treated with a charge-modifying component, thereby enhancing the sag-resistance of the building panel.

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

Described in this disclosure is a surface configured to break down deposits thereon. The surface may include breakdown structures, oleophilic structures, and hydrophilic structures. The oleophilic structures and hydrophilic structures are configured to disperse a deposit, such as fingerprint residue, to the breakdown structures. This dispersion increases the surface area of the deposit with respect to the breakdown structures, increasing the contact area between the two. The breakdown structures modify the deposit physically, chemically, or both, such that fragments are distributed into the ambient environment. The surface may be applied to portable electronic devices.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

A wearable article such as an article of athletic gear (e.g., a skate, an article of protective athletic equipment such as a helmet, etc.) wearable by a user and comprising an expandable user-engaging structure that is configured to be expanded (e.g., by heat or another stimulus) after manufacturing of the wearable article to conform it to the user or otherwise improve a fit of the wearable article on the user.

A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).