An object of the present invention is to provide a polymer film having a low dielectric loss tangent and a small difference in a linear expansion coefficient from that of a copper foil; and a laminate.

The polymer film of an embodiment of the present invention is a polymer film including a liquid crystal polymer, in which a hardness A at a distance of half of a thickness of the polymer film and a hardness B at a distance of 1/10 of the thickness of the polymer film satisfy a relationship of Expression (1A), and in a case where positions at distances of 1/10, 4/10, and 6/10 of the thickness of the polymer film are defined as a position T1, a position T2, and a position T3, respectively; and a region from the one surface to the position T1 is defined as a first surface layer region, and a region from the position T2 to the position T3 is defined as a central region, a void area proportion X in the first surface layer region and a void area proportion Y in the central region satisfy a relationship of Expression (2A).

[00001]$\left(\text{Hardness A + Hardness B}\right)/2\ge 0.10\text{GPa}$

[00002]$\text{Void area proportion Y - Void area proportion X}\ge \text{0}\text{.10\%}$

A waterproofing system including a functional layer S1 including 10-80 wt.-% of at least one thermoplastic polymer P1 and 10-80 wt.-% of at least one solid particulate filler F, wherein the surface of the functional layer S1 has an Auto-correlation length of waviness W(Sal) of at least 50 μm. Further, a method for producing a waterproofing system and to the use of a mechanical surface treatment step to increase the waviness factor, determined as the ratio of the Root mean square roughness of waviness W(Sq) to the square of the Auto-correlation length of waviness W(Sal), of a surface of a functional layer S1.

An antenna packaged substrate includes: a substrate, a first antenna radiating patch disposed on a surface of the substrate, a second antenna radiating patch disposed over the first antenna radiating patch, and a dielectric stack disposed between the first antenna radiating patch and the second antenna radiating patch. The dielectric stack includes a first dielectric layer, a bonding layer disposed on a side that is of the first dielectric layer and faces the first antenna radiating patch, and a second dielectric layer disposed on a side that is of the first dielectric layer and faces the second antenna radiating patch. A dielectric constant of the first dielectric layer is lower than a dielectric constant of the substrate, and an expansion coefficient of the second dielectric layer is lower than an expansion coefficient of the first dielectric layer.

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

A composite cooling film including non-fluorinated organic polymeric layer, a metal layer disposed inwardly of the non-fluorinated organic polymeric layer, and an antisoiling, ultraviolet-absorbing hardcoat layer that is disposed outwardly of the non-fluorinated organic polymeric layer.

The disclosure relates to acoustic panels and methods for preparing them. The disclosure relates more particularly to panels having a porous facing and to methods for making such panels. One aspect of the disclosure is an acoustic panel comprising a base structure. The base structure has one or more edges, an outward major surface having a total area, and an inward major surface opposing the outward major surface. The base structure has a noise reduction coefficient (NRC) of at least about 0.3. The panel includes a coating layer directly disposed on the outward major surface of the base structure, the coating layer being formed of an open-cell foam. The coating layer has an exterior major surface opposing the outward major surface of the base structure. The coating layer is substantially scattering for light in the wavelength range of 380 nm to 780 nm, and has an absorption coefficient of less than 0.5 for acoustic frequencies in the range of 100 Hz to 10,000 Hz.

The invention relates to a multilayer plastic film, in particular a multilayer plastic composite film, preferably a multilayer plastic packaging film, based on plastic recyclate (recycled plastic), in particular based on plastic recyclate originating from waste, with a plastic recyclate content of at least 80% by weight, based on the plastic film, and to its use, in particular as packaging material. The plastic recyclate is preferably post-consumer plastic recyclate (PCR plastic recyclate), in particular PCR recycled films.

A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.

A composite sandwich panel assembly including an open area core, a high gloss surface sheet, and a structural skin. The open are core defines a plurality of pores and has a first face and an opposing second face. The high gloss surface sheet is adhered to the first face of the open area core by a first adhesive layer. The high gloss surface sheet has a high gloss surface. The structural skin is adhered to the second face of the open area core by a second adhesive layer. A process for forming the composite sandwich panel assembly includes positioning the high gloss surface sheet, joining the first face of the open area core to the high gloss surface sheet with a first adhesive layer intermediate therebetween, and joining the structural skin to the second face of the open area core with a second adhesive layer intermediate therebetween.

The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 μm and a second metal foil laminated in this order, and patterning the second metal foil.