Described herein is an antiviral face mask and methods of use thereof to inactivate a virus in contact with the face mask. The face mask may include a fibrous material with silicon nitride powder impregnated therein and a layer surrounding the fibrous material. In some embodiments, silicon nitride is present in the fibrous material at a concentration of about 30 wt. % to about 50 wt. %.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.

A compostable laminate for food wrap and method for making same. The wrap can include a first layer of paper material, a second layer of paper material, and a series of coatings between the paper materials. The coatings include a first flood coating having water and/or barrier properties, a second flood coating having water and/or oil barrier properties, and a third coating that only partially covers the second flood coating. None of the first, second and third coatings comprise a thermoplastic or polyolefin, and are made substantially from one or more biodegradable and/or compostable materials.

Various embodiments disclosed relate to a composite shingle. The composite shingle includes a particle layer and a polyketone layer proximate to the particle layer.

A radiative cooling fabric comprises a flexible substrate layer and a functional layer stacked in order. The first functional layer comprises a first functional resin and a first functional filler dispersed in the first functional resin. A mass fraction of the first functional filler in the first functional layer is in a range of 1% to 20%. An emissivity of the radiative cooling fabrics in the wavelength of 7 μm to 14 μm is not less than 80%. A reflectivity of the radiative cooling fabrics in the wavelength of 300 nm to 2500 nm is not less than 80%. An average value of warp recovery angles of the radiative cooling fabrics is greater than or equal to 95°, and an average value of the weft recovery angles of the radiative cooling fabrics is greater than or equal to 91°.

A high-frequency dielectric heating adhesive sheet includes: a first adhesive layer; a second adhesive layer; and an intermediate layer located between the first adhesive layer and the second adhesive layer, the first adhesive layer containing a first thermoplastic resin and a first dielectric filler configured to generate heat in response to a high-frequency wave, the second adhesive layer containing a second thermoplastic resin and a second dielectric filler configured to generate heat in response to the high-frequency wave, the intermediate layer containing no dielectric filler in response to the high-frequency wave.

Provided is a laminate having a porous layer that can ensure the drying property of a printing ink and can also be produced with less gum residue generated. A laminate comprising a substrate layer (A) and a porous layer (B), wherein the porous layer (B) comprises a thermoplastic resin and a filler, the filler comprises a filler having a hydrophobized surface, as a part thereof, and the porous layer (B) has a liquid-absorptive capacity of 10 to 40 cc/m.sup.2 as measured in accordance with JIS P 8140:1998 with a 70 mass % ethanol aqueous solution.

A charging member for an image forming apparatus may include a conductive support and a surface layer on the conductive support and not in contact with a photosensitive member. The surface layer may comprise a urethane foam including foam cells and having a foam structure based on the foam cells, the foam cells including open cells.

A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

The present disclosure relates to a multilayer composite that may include a first porous layer, and a first barrier layer overlying the first porous layer. The first barrier layer may include a polyaramid material, a polyimide material, or any combination thereof. The multilayer composite may have a flame resistance rating of at least about 180° C. and a 50% strain compression rating of not greater than about 600 kPa.