A porous ceramic structure includes one sheet, and a porous ceramic aggregate bonded on the sheet. The porous ceramic aggregate includes a plurality of porous ceramic particles.

According to a method of preparing a conductive magnetic composite sheet, the method comprising preparing a magnetic sheet comprising a magnetic powder and a binder resin; stacking the magnetic sheet and a first conductive foil; and applying heat and pressure to the obtained stack to bond the magnetic sheet and the first conductive foil, a conductive magnetic composite sheet having excellent interlayer adhesion between the magnetic sheet and the conductive foil can be prepared while having an excellent magnetic property at NFC, WPC, and MST frequencies.

A first object of the present invention is to provide a stretchable conductor sheet that exhibits isotropic conductivity when stretched in a predetermined direction or in a direction perpendicular to the predetermined direction, and a paste for forming a stretchable conductor sheet, which is used for the stretchable conductor sheet. A second object of the present invention is to provide a stretchable conductor sheet having a small change in specific resistance even when repeatedly twisted, and a paste for forming a stretchable conductor sheet, which is used for the stretchable conductor sheet. A third object of the present invention is to provide a stretchable conductor sheet having a small change in specific resistance even when repeatedly washed, and a paste for forming a stretchable conductor sheet, which is used for the stretchable conductor sheet. The first object of the present invention can accomplish a stretchable conductor sheet having a thickness of 3 to 800 μm, the stretchable conductor sheet comprising at least conductive particles, inorganic particles surface-treated with a hydroxide and/or an oxide of one or both of Al and Si, and a flexible resin having a tensile elastic modulus of 1 MPa or more and 1000 MPa or less, wherein in each of two orthogonal directions, a specific resistance change ratio of the sheet at a time of elongation by 40% with respect to an original length is less than ±10% in an elongation direction.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

Described herein are resilient floor coverings produced by using digitally printed UV-cured inks and exhibiting high adhesion properties between an ink layer and a wear layer. Also described herein are methods for manufacturing same. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

A method of fabricating a part out of composite material, includes forming a fiber texture from refractory fibers; impregnating the fiber texture for a first time with a first slip containing first refractory particles; eliminating the liquid phase from the first slip so as to leave within the texture only the first refractory particles; impregnating the fiber texture for a second time with a second slip containing second refractory particles; eliminating the liquid phase from the second slip so as to leave within the texture only the second refractory particles and obtain a fiber preform filled with the first and second refractory particles; and sintering the first and second refractory particles present in the fiber preform in order to form a refractory matrix in the preform.

A composite structure may comprise a composite core comprising a composite material, and a heat resistant system coupled to the composite core comprising a binder and/or at least one of a heat dissipation material or a thermal barrier material. The heat dissipation material may comprise boron nitride, graphene, graphite, carbon fiber, carbon nanotubes, aluminum foil, and/or copper foil, and the thermal barrier material may comprise montmorillonite, aluminum hydroxide, magnesium hydroxide, silicate glass, mica powder or flake, aluminum oxide powder, titanium dioxide powder, and/or zirconium oxide powder. The binder may comprise at least one of polyvinyl alcohol, polyvinyl alcohol copolyacetate, polyacrylamide, polyethylene glycol, polyethylenimine, polyurethane, polyester, or latex.

A soft armor panel is provided by work softening a panel formed of a ballistic material. The panel also includes slip planes between adjacent ply groups, the adjacent ply groups remaining unconnected or substantially unconnected at the slip plane. The soft, or conformable, body armor, is resistant to various projectile threats, in which the panel is made by work-softening an otherwise rigid panel. The soft armor panel includes a work softened lamination of a plurality of ply groups. Each ply group comprises one or more layers, each layer comprising a composite material of fibers embedded in a matrix material. A slip plane is disposed between at least one set of adjacent ply groups, such that the adjacent ply groups remain unconnected or substantially unconnected at the slip plane. The softened ballistic panel retains significant ballistic properties, is light weight and can be readily conformed to various torso configurations.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

An epoxy resin composition, and a prepreg, a laminate, and a metal foil-clad laminate manufactured using same. The epoxy resin composition comprises epoxy resin (A), phenolic curing agent (B), high molecular weight resin (C), and an optional inorganic filler (D), the high molecular weight resin (C) having the structure shown in formula (1), formula (2), formula (3), and formula (4), the weight-average molecular weight being between 100,000 and 200,000, and the content of the epoxy resin (A) containing a naphthalene ring skeleton and the phenolic curing agent (B) containing a naphthalene ring skeleton being 0%. The present epoxy resin composition, and the prepreg, the laminate, and the metal foil-clad laminate manufactured using same have good heat resistance, low modulus, and a low coefficient of thermal expansion. The formulas are:

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