A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

The disclosure relates to a sandwich composite board and a preparation method thereof. The sandwich composite board includes, from top to bottom, an upper panel layer, a core material layer, and a lower panel layer, wherein the upper panel layer and the lower panel layer are glass or fiber reinforced resin-based composite sheets; and the core material layer is composed of an aerogel, a resin, and an expandable microsphere foaming agent. Method (1) includes: heating and melting the resin to obtain slurry A, cooling the same, adding the aerogel and the expandable microsphere foaming agent thereto, and uniformly mixing the same to obtain slurry B, then flat-laying the lower panel layer, coating or printing with the slurry B, then laying the upper panel layer and hot press molding the same. Method (2) includes: uniformly mixing an aerogel, a resin and an expandable microsphere foaming agent to obtain mixture A, placing the mixture A into a non-woven bag, sealing to obtain a core material B, flat-laying the lower panel layer, flat-laying the core material B, then laying the upper panel layer, and hot press molding the same.

A high-frequency dielectric heating adhesive sheet includes an adhesive layer. The adhesive layer contains a thermoplastic resin having a reactive site, a dielectric filler that generates heat upon application of a high-frequency electric field, and a silane coupling agent.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 μm to 100 μm.

The present invention provides a film and/or a packaging bag from which contents that may be viscous are easily brought out, and exhibiting enough heat seal properties as well as superior anti-blocking effect and slipperiness. The sealant film has a seal layer consisting of a resin composition including the following (a) and (b), and the film satisfies the following (1) to (3). (a) Polyolefin-based resin; and (b) Silylated polyolefin resin, (1) An abundance ratio (Si/C) of silicon atoms Si to carbon atoms C included in the seal layer of 0.001 or more and 0.02 or less; (2) An abundance ratio (Si/C) of silicon atoms Si to carbon atoms C present at a surface of the seal layer of 0.05 or more and 0.2 or less; and (3) An arithmetic average roughness Ra of a surface of the seal layer of 0.1 μm or more and 0.5 μm or less

A sheet assembly can be cut into one or more cards. The sheet assembly includes an upper sheet configured to receive a first printing of first indicia for the one or more cards, a polymer core coupled with the upper sheet, and a lower sheet configured to receive a second printing of second indicia for the one or more cards. The lower sheet is coupled with the polymer core with the polymer core disposed between the upper sheet and the lower sheet. The upper sheet, polymer core, and/or the lower sheet is or are formed from a polymer binder with inorganic particles dispersed in the polymer binder. The inorganic particles can have a first density of the inorganic particles that is less than four times a second density of the polymer binder and/or a mass-median-diameter (D.sub.50) of the inorganic particles can be larger than ten microns in size.

A composite panel structure of a polymer matrix core sandwiched by metal layers is described. The polymer matrix comprises 1-30 wt % fluoropolymer and 70-99 wt % of a flame retardant mineral. The fluoropolymer may be polyvinylidene fluoride (PVDF) with a high limiting oxygen index, which confers fire resistance properties to the polymer matrix and the composite panel structure. The composite panel structure may be used on the exterior of buildings and may fulfill building code requirements for the polymer matrix core being noncombustible as determined by ASTM E136 and CAN/ULC S114 compliance.

Low combustibility thermal insulation and methods of use and preparation thereof are described herein. The low combustibility thermal insulation may include a foam composite comprising a polymer material and a fire retardant component disposed in and/or adjacent to the polymer material; and a first controlled combustion layer adjacent to a first surface of the foam composite, wherein the foam composite and first controlled combustion layer are configured to control combustion of the insulation such that a total heat generated in a period of 10 minutes by the panel is equal to or less than 8 MJ/m.sup.2, as measured according to ISO 5660-1, and wherein a thermal conductivity of the insulation is equal to or less than 0.050 W/m K.

As an exemplary configuration, a long film is configured by thermomeltable polymers including a first unit based on tetrafluoroethylene and a second unit based on perfluoro (alkyl vinyl ether), including spherulites of the thermomeltable polymers, wherein radius of each spherulite is 10 μm or less. As another exemplary configuration, a long film is configured by tetrafluoroethylene polymers having a melt flow rate within a range of 5 to 40 g/10 min. The long film is heated at 180° C. for 30 minutes so as to measure the thermal expansion rate, and when letting thermal expansion rate in a first direction, which extends at a 45-degree angle to a melt flow direction be A, and thermal expansion rate in a second direction orthogonal to the first direction be B, A and B are respectively within the range of −2 to +1%, and |A−B| is 1% or less.

A sound-insulating material includes 16 to 24% by weight of a base resin having a thermoplastic olefin (TPO) and a polyolefin elastomer (POE) and 76 to 84% by weight of an inorganic filler. The sound-insulating material can be used, for example, as part of a sound-absorbing and sound-insulating material in a vehicle.