B32B2264/303

COMPOSITE THERMOPLASTIC MATERIAL FOR COMPOSITE TUBULAR STRUCTURES
20240066827 · 2024-02-29 ·

The invention relates to a composition comprising at least one fluoropolymer and at least one high-density filler. The invention also relates to a thermoplastic composite tubular structure which comprises at least one external layer consisting of said composition. The invention also relates to the process for the manufacture of said composition, and also to its applications as external layer for weighing down thermoplastic composite pipes transporting fluids in the context of oil and gas exploration and exploitation.

BIAXIALLY ORIENTED COMPOSTABLE COMPOSITE FILM
20240066847 · 2024-02-29 ·

Multi-layer biaxially oriented compostable composite film with a sealant layer formulation has improved heat seal initiation temperature, enhanced plateau seal strength, and broadened heat seal temperature range, while optical clarity is maintained, and film modulus (noise) is reduced. The film includes a core layer comprising a PLA-rich biodegradable composite resin, and a heat sealable layer comprising 20 to 60 wt % amorphous polylactic acid resin, and 40 to 80 wt % flexible compostable polymeric modifier Y having a glass transition temperature of Tg?0? C. and a melting temperature of 56? C.?Tm?90? C. Specifically, the flexible compostable polymeric modifier includes 20 to 70 wt % polybutylene succinate-co-adipate (PBSA) copolymer and 5 to 35 wt % polycaprolactone as a promoter of low heat seal initiation temperature (SIT) and hermeticity. The inventive compostable composite film is desirable to have improved home compostability.

BIAXIALLY ORIENTED PHA-RICH COMPOSITE FILM
20240066848 · 2024-02-29 ·

A biaxially oriented multi-layer composite film comprises a PHA-rich core layer and a heat sealant layer and a second outer skin layer. The core layer comprises a PHA resin at an amount of more than 50 wt % of a total weight of the core layer and a modifier X, the modifier X includes PLA, PLA copolymers, PBSA and PCL; the heat sealant layer comprises a PLA resin and a modifier Y, the modifier Y including PBSA and PCL resins is at an amount of about 20 wt % to 95 wt % of the total weight of the heat sealant layer. The composite film has low SIT and improved home compostability.

Multilayer films and adhesive tapes

Multilayer films and adhesive tapes that include such films, wherein the multilayer films include plasticized polyvinyl chloride and optionally one or more fillers.

METHOD FOR OBTAINING A LAMINATED CURVED GLAZING
20240059048 · 2024-02-22 ·

A method for obtaining a laminated curved glazing, includes a. providing a first glass sheet, covered on at least part of one of its faces with a stack of thin layers, b. depositing, on a part of a surface of the stack of thin layers, a layer of enamel, the deposition being carried out by screen-printing an enamel composition including refractory particles having a diameter of at least 20 m in a proportion by volume of at least 0.5%, but no particles having a diameter greater than 80 m, c. bending the first glass sheet, the stack of thin layers located under the enamel layer being completely dissolved by the enamel layer at least at the end of the bending, and then d. laminating the first glass sheet with an additional glass sheet with an lamination interlayer, so that the enamel layer faces the interlayer.

SMALL-SIZED CALCIUM CARBONATE PARTICLES IN NONWOVENS AND FILMS
20240059870 · 2024-02-22 ·

Nonwovens, films, and composites thereof are provided, in which at least the nonwoven or film has a plurality of small-sized calcium carbonate (CaCO.sub.3) particles having generally narrow distribution.

ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE
20240052206 · 2024-02-15 ·

A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm.sup.3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,


TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C.(Numerical Formula 11)


TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)10 degrees C.(Numerical Formula 12).

Metal-plastic plain-bearing composite material and plain bearing element produced therefrom
11946507 · 2024-04-02 · ·

The invention relates to a metal-plastic plain-bearing composite material (2), in particular for producing plain bearing elements for lubricated applications, comprising a metal support layer (4), in particular of steel or bronze, and comprising a sliding layer (12) of a sliding material (8) of a matrix-forming PTFE polymer base with fillers that improve the tribological properties, said sliding layer being in sliding contact with a sliding partner, characterized in that the sliding material contains as fillers 1-15 vol % barium sulfate, 5-20 vol % aramid, 1-10 vol % polyimide and 1-15 vol % fluorothermoplastic, excluding PTFE, as well as a plain-bearing composite material and a plain bearing element.

RESIN FILM MATERIAL, LAMINATED STRUCTURE COMPRISING RESIN FILM MATERIAL, RESIN COMPOSITION MANUFACTURING METHOD, RESIN FILM MATERIAL MANUFACTURING METHOD, AND LAMINATED STRUCTURE MANUFACTURING METHOD

The present invention provides a resin film material produced from a resin material that includes a laminate that includes a resin layer with an evaporated metal layer, the resin film material containing a metal in the evaporated metal layer in the form of particles, wherein the metal particles are dispersed in the resin film material, and the number of metal particles with an area-equivalent diameter of 200 m or more present per cm.sup.2 of the resin film material is 1 or less. It is preferable that the resin film material is produced from a resin material that is made of a laminate group that includes the laminate that includes a resin layer with an evaporated metal layer and a laminate that includes a metal layer-free resin layer.

Prepreg and metallic clad laminate

A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.