A component (A1) thereof includes an epoxy resin having at least one of a naphthalene skeleton or a biphenyl skeleton. A component (A2) thereof includes a phenolic resin having at least one of the naphthalene skeleton or the biphenyl skeleton. A component (B) thereof includes a high molecular weight substance having structures expressed by at least formulae (b2) and (b3) out of formulae (b1), (b2), and (b3) and having a weight average molecular weight equal to or greater than 200,000 and equal to or less than 850,000. A component (C1) thereof includes a first filler obtained by subjecting a first inorganic filler to surface treatment using a first silane coupling agent expressed by formula (c1). A component (C2) thereof includes a second filler obtained by subjecting a second inorganic filler to surface treatment using a second silane coupling agent expressed by formula (c2).

This invention relates to a polymer composition that is particularly suitable for use in the manufacture of thermoformed articles, which can be biodegraded in industrial composting. This invention also relates to a process for the production of the said composition and articles obtained thereby.

A composite material for passive radiative cooling is provided. In some embodiments, the composite material includes a base layer, and at least one emissive layer located adjacent to a surface of the base layer. In some embodiments, the at least one emissive layer is affixed to the surface of the base layer via a binding agent. In some embodiments, the surface of the base layer comprises a reflective substrate comprising an adhesive layer. In some embodiments, the at least one emissive layer is affixed to the base layer via the adhesive layer of the base layer.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

This invention relates to a polymer composition that is particularly suitable for use in the manufacture of thermoformed articles, which can be biodegraded in industrial composting. This invention also relates to a process for the production of the said composition and articles obtained thereby.

A composite foam article comprises a foam core layer presenting a first surface and a second surface facing opposite the first surface. A first polymeric bonding layer is disposed on the first surface, one or more first reinforcing layers comprising a plurality of fibers and a polymeric binder are disposed on the first polymeric bonding layer, and a first polymeric containment layer is disposed on the one or more first reinforcing layers. A second polymeric bonding layer is disposed on the second surface, one or more second reinforcing layers comprising a plurality of fibers and a polymeric binder are disposed on the second polymeric bonding layer, and a second polymeric containment layer is disposed on the one or more second reinforcing layers. At least one catch layer comprising particles of carbon is dispersed in and/or disposed between any of the aforementioned layers.

A composite foam article is disclosed herein. The composite foam article comprises a polyurethane foam core presenting a first surface and a second surface facing opposite the first surface. A first skin is disposed on the first surface and a second skin is disposed on the second surface. The polyurethane foam core has a density of 15-80 kg/m.sup.3. The first and second skins comprise a plurality of fibers and a polymeric binder. The composite foam article has a weight per unit area of 500-1000 g/m.sup.2 and a strength of greater than 17 N at a post-compression thickness of greater than 2 mm when tested in according with SAE J949 at 23° C.

In an aspect a method of manufacturing an acoustic floor panel is described. The method may include: combining a binding agent with plastic flakes; passing the plastic flakes and the binding agent to a lamination machine; applying a force to the binding agent and the plastic flakes using the lamination machine to create a plastic sheet; cutting the plastic sheet; and adding an acoustic insulator to at least a first side of the plastic sheet.

The disclosure provides an adjusting device having an active region and a peripheral region adjacent to the active region. The adjusting device includes a first substrate, a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer, and a sealant layer. The first insulating layer is disposed on the first conducting layer and includes a first opening disposed in the peripheral region. The second conducting layer is disposed on the first conducting layer and electrically connected to the first conducting layer through the first opening. The second insulating layer includes multiple first protruding structures disposed in the peripheral region and on the first insulating layer. The sealant layer is disposed in the peripheral region and on the second insulating layer. The first opening is disposed between two of the first protruding structures.

The present disclosure relates to a dielectric substrate that may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a D.sub.10 of at least about 1.0 microns and not greater than about 1.7, a D.sub.50 of at least about 1.0 microns and not greater than about 3.5 microns, and a D.sub.90 of at least about 2.7 microns and not greater than about 6 microns.