An improved cover board product with a panel comprised of three discrete layers: a top surface layer comprised of either paper or a fiberglass web, a bottom surface layer comprised of either paper or a fiberglass web, and a core layer comprised of discrete paper fragments and polypropylene fragments, which are connected by use of a thermoplastic bonding resin, including polyethylene. The bonding resin is generally attached in a random pattern to less than 100% of the paper fragment and polypropylene fragment surface area. The paper fragments are generally shaped as irregular plates. The polypropylene fragments can have multiple shape types. The two different fragment types are randomly distributed in the core layer relative to each other. The core layer includes small voids in and around the particles, which improves flexibility. The core layer is attached to the top and bottom surface layers by use of a thermoplastic adhesive, including polyethylene.

An improved cover board product with a panel comprised of three discrete layers: a top surface layer comprised of either paper or a fiberglass web, a bottom surface layer comprised of either paper or a fiberglass web, and a core layer comprised of discrete paper fragments and polypropylene fragments, which are connected by use of a thermoplastic bonding resin, including polyethylene. The bonding resin is generally attached in a random pattern to less than 100% of the paper fragment and polypropylene fragment surface area. The paper fragments are generally shaped as irregular plates. The polypropylene fragments can have multiple shape types. The two different fragment types are randomly distributed in the core layer relative to each other. The core layer includes small voids in and around the particles, which improves flexibility. The core layer is attached to the top and bottom surface layers by use of a thermoplastic adhesive, including polyethylene.

The present invention relates to a method of manufacturing a quantum-dot film having encapsulated quantum dots dispersed therein, in which quantum dots are uniformly dispersed in a matrix resin to thus increase quantum yield and in which deterioration of the quantum dots can be prevented through encapsulation, a quantum-dot film manufactured thereby, and a wavelength conversion sheet and a display including the same.

A laminated glass according to an embodiment of the present invention includes a first glass plate, a second glass plate, and an interlayer film held between the first glass plate and the second glass plate. When a relative dielectric constant of the first glass plate is represented by ?.sub.g1; a relative dielectric constant of the second glass plate is represented by ?.sub.g2; a relative dielectric constant of a first interlayer film provided in a first region of the interlayer film is represented by ?.sub.m1; a reflection coefficient at an interface between the first glass plate and the first interlayer film is represented by ?.sub.1; and a reflection coefficient at an interface between the second glass plate and the first interlayer film is represented by ?.sub.2, the reflection coefficients ?.sub.1 and ?.sub.2 satisfy relations 0.0??.sub.1?0.2 and 0.0??.sub.2?0.2.

The present invention is applicable in the field of substrates for high-frequency circuits, and for example, relates to a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using same. The composite polyimide substrate according to the present invention may include: a substrate main body including a polyimide of which at least a portion has been substituted with a polyester group; and polytetrafluoroethylene (PTFE) particles included in the substrate main body.