A method of forming a sandwich structure including at least partially filling an open volume of an open cellular core with a sacrificial mold material, consolidating the sacrificial mold material to form a sacrificial mold, laying up a composite facesheet on each of at least two surfaces of the open cellular core, co-curing the composite facesheets by applying a consolidation temperature and a compaction pressure to the composite facesheets to form the sandwich structure, and removing the sacrificial mold. The compaction pressure is greater than a compressive strength of the open cellular core and less than a combined compressive strength of the open cellular core and the sacrificial mold.

A method of producing a laminated article comprising placing a first metal skin, a core, and a second metal skin freely onto each other as discreet layers to provide a layered component; and forming the layered component into a shaped article via a die prior to producing a laminated article by applying pressure and heat to the shaped article, wherein at least the first skin moves relative to the core and/or second skin during the forming.

A fiber-reinforced composite blank for a fiber-reinforced composite component, in particular for a fiber-reinforced composite component of a wind turbine, comprising a layered construction with a form core consisting of or comprising a form core material, and a fiber layer adjoining the form core, said fiber layer consisting of or comprising a fiber layer material, and a plurality of reinforcing rods introduced into the form core and consisting of or comprising a reinforcing material, wherein the reinforcing material has a higher stiffness than the form core material. In this arrangement, the plurality of reinforcing rods is introduced into the form core at an angle to a form core plane. Furthermore, at least one reinforcing rod of the plurality of reinforcing rods is introduced into the form core at an angle to a direction orthogonal to the form core plane.

Provided is a protection film including a plurality of layers, including a first carrier layer having a plurality of electrically conductive fibers; a metal layer; and a second carrier layer having a plurality of electrically conductive fibers. Each of the first and second carrier layers has a void volume at least partially filled with a hardenable composition. Also provided is a protection film including a first metal layer, a carrier layer, and a second metal layer, in which the carrier layer is at least partially filled with a hardenable composition. These films can provide lightning strike protection with suitable tensile, rigidity and tack properties for automatic tape layup and automatic fiber placement applications.

The present application relates to a composite material. The present application can provide a composite material having high magnetic permeability and also having excellent mechanical properties such as flexibility. The composite material may be used in various applications, and for example, may be used as an electromagnetic-wave shielding material and the like.

The present application relates to an asymmetry composite material and a method for preparing the same, which provides a composite material comprising a metal porous body (metal foam or the like) and a polymer component, and provides a method for preparing a composite material, wherein the polymer component is formed in an asymmetrical structure on both sides of the metal porous body (metal foam or the like), and a composite material prepared in such a manner.

The present disclosure can provide an aerogel composite. The aerogel composite comprises at least one base layer having a top surface and a bottom surface, the base layer comprising a reinforced aerogel composition which comprises a reinforcement material and a monolithic aerogel framework, a first facing layer comprising a first facing material attached to the top surface of the base layer, and a second facing layer comprising a second facing material attached to the bottom surface of the base layer. At least a portion of the monolithic aerogel framework of the base layer extends into at least a portion of both the first facing layer and the second facing layer. The first facing material and the second facing material can each comprise or consist essentially of elastic fibers such as spandex, nylon, lycra, elastane, or combinations thereof.

A gas turbine hot part includes: a body portion; a porous portion forming at least a part of the body portion or disposed on at least a part of the body portion and allowing a cooling gas to pass therethrough; and at least one filter disposed upstream of the porous portion in a flow direction of the cooling gas and capable of trapping foreign substances that cannot pass through the porous portion.

The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body.

Disclosed is a joining film 13 for joining a semiconductor element 2 and a substrate 40, the joining film having an electroconductive joining layer 13a formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer 13b having tackiness and being laminated with the electroconductive joining layer. The tack layer 13b is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer 13a are sintered, and thereby the semiconductor element 2 and the substrate 40 are joined.

The invention provides a joining film having sufficient connection heat resistance and high reliability, for which a joining process of joining a semiconductor element and a substrate is simple and easy, a tape for wafer processing, a method for producing a joined body, and a joined body. Disclosed is a joining film for joining a semiconductor element and a substrate, the joining film having an electroconductive joining layer formed by molding an electroconductive paste containing metal fine particles (P) into a film form; and a tack layer having tackiness and being laminated with the electroconductive joining layer. The tack layer is thermally decomposed by heating at the time of joining, the metal fine particles (P) of the electroconductive joining layer are sintered, and thereby the semiconductor element and the substrate are joined.