One aspect of the invention provides a system including: a length of energy-dissipative tubing; a first sealing device coupled to a first end of the length of energy-dissipative tubing; and a second sealing device coupled to a second end of the length of energy-dissipative tubing. Exposure to one or more selected from the group consisting of: fault currents or lightning strikes at an exposure point along the length of energy-dissipative tubing will produce arcs at the exposure point and at least one of the first end and the second end.

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

Provided in the embodiments of the present disclosure are a support sheet for supporting a flexible display screen, a flexible display screen and an electronic device. The flexible display screen support sheet includes a carbon fiber substrate and an epoxy resin adhesive. The carbon fiber substrate includes first carbon fibers in a first direction and a second carbon fibers in a second direction, and the first direction being different from and angled with the second direction.

A multi-layer and method of making the same are provided. The multi-layer, such as a sensor, can include a high strength glass overlay and a lamination layer on a substrate layer. The overlay can be less than 250 micrometers thick and have at least one tempered surface incorporating a surface compression layer of at least 5 micrometers deep and a surface compressive stress of at least 200 MPa. The overlay can exhibit a puncture factor of at least 3000 N/μm.sup.2 at B10 (10.sup.th percentile of the probability distribution of failure) in a multi-layer structure, an apparent thickness of less than 0.014 mm, and a pencil hardness greater than 6H. The method can include ion-exchange tempering at least one major surface of a glass sheet, light etching the major surface to remove flaws and laminating the glass sheet on the tempered and lightly etched major surface to a substrate layer.

This disclosure is to provide a laminate with improved adhesiveness between the layers, and a conductive roller having the laminate. The laminate of this disclosure is a laminate comprising at least 2 or more energy ray curable resin layers formed by curing a resin composition with an energy ray, wherein: the laminate has an energy ray curable resin layer (1) and an energy ray curable resin layer (2); and a first resin composition used in formation of the energy ray curable resin layer (1) contains an energy ray curable resin (A) having a hydrocarbon ring skeleton.

A method for manufacturing a ceramic substrate containing glass includes a firing step in which an unfired silver-based conductor material is disposed on an unfired ceramic layer and is fired. The unfired silver-based conductor material contains at least one of a metal boride and a metal silicide.

An element including: a first electrode; an intermediate layer made of a silicone rubber composition containing a silicone rubber; and a second electrode, where the first electrode, the intermediate layer, and the second electrode are disposed in this order, wherein a peak intensity ratio (1095±5 cm.sup.−1/1025±5 cm.sup.−1) of an infrared absorption spectrum of the intermediate layer varies along a vertical direction relative to a surface of the first electrode, and to a surface of the second electrode.

The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by general formula (1):

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wherein a plurality of R each independently represent any of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.

Provided are a transparent conducting film laminate to which a curl generated during a heating step and after the heating step can be controlled, and a method for processing the same. A transparent conducting film laminate comprises a transparent conducting film 20 and a carrier film 10 stacked thereon, wherein the transparent conducting film 20 comprises a transparent resin film 3, transparent conducting layer 4, and an overcoat layer 5 stacked in this order, the transparent resin film 3 having a thickness T.sub.1 of 5 to 25 μm and being made of an amorphous cycloolefin-based resin, the carrier film 10 is releasably stacked on the other main face, the face opposite to the face having the transparent conducting layer 4, of the transparent resin film 3 with an adhesive agent layer 2 therebetween, and a protection film 1 has a thickness T.sub.2 which is 5 times or more of the thickness T.sub.1 of the transparent resin film 3 and is 150 μm or less, and is made of polyester having an aromatic ring in its molecular backbone.

A flexible flat cable (FFC) includes a first insulation layer, at least one pair of conductors, a plurality of low-k dielectric layers, two second insulation layers, and at least one shielding layer. The pair of conductors is located within the first insulation layer. Each pair of conductors includes a plurality of first conductors, and the first conductors are axially extending and arranged in parallel. The low-k dielectric layers are embedded in the first insulation layer. Each of the pair of conductors or each of the first conductors is covered and surrounded with one low-k dielectric layer. The two second insulation layers are located on two surfaces of the first insulation layer. The shielding layer is located on the two second insulation layers opposite to the first insulation layer.