A polymer bilayer includes a layer of a porous fluoropolymer directly overlying a layer of polyethylene. The polyethylene layer may be porous or dense and may include an ultra-high molecular weight polymer. The polymer bilayer may be co-integrated with structures (e.g., wearable devices) exposed to high thermal loads (>0-1000 W/m.sup.2) and provide passive cooling thereof. For instance, passive cooling of AR/VR glasses under different solar loads may be achieved by a polymer bilayer that is both highly reflective across solar heating wavelengths and highly emissive in the long-wavelength infrared. The high reflectance decreases energy absorption across the solar spectrum while the high emissivity promotes radiative heat transfer to the surroundings.

A polymer bilayer includes a layer of a porous fluoropolymer directly overlying a layer of polyethylene. The polyethylene layer may be porous or dense and may include an ultra-high molecular weight polymer. The polymer bilayer may be co-integrated with structures (e.g., wearable devices) exposed to high thermal loads (>0-1000 W/m.sup.2) and provide passive cooling thereof. For instance, passive cooling of AR/VR glasses under different solar loads may be achieved by a polymer bilayer that is both highly reflective across solar heating wavelengths and highly emissive in the long-wavelength infrared. The high reflectance decreases energy absorption across the solar spectrum while the high emissivity promotes radiative heat transfer to the surroundings.

A rubber resin material with high thermal conductivity and a metal substrate with high thermal conductivity are provided. The rubber resin material includes inorganic fillers and a rubber resin composition with high thermal conductivity. The rubber resin composition with high thermal conductivity includes 40 wt % to 70 wt % of a liquid rubber, 10 wt % to 30 wt % of a polyphenylene ether resin, and 20 wt % to 40 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

An embodiment of the present disclosure provides a metal architectured plate with senses of tactile warmth and elasticity. According to an embodiment of the present disclosure, there is an effect that it is possible to provide a metal architectured plate with senses of tactile warmth and elasticity which is configured by stacking sheet-like metal architectured materials having micro-thickness with senses of tactile warmth and elasticity, the metal architectured materials including base microchannels formed with regular intervals; and microchannels with senses of tactile warmth and elasticity formed to protrude between the base microchannels, such that the base microchannels and the microchannels with senses of tactile warmth and elasticity form channels with senses of tactile warmth and elasticity, which are spaces for allowing control of thermal conductivity and an elastic modulus, thereby imparting human-friendly senses of tactile warmth and elasticity.

A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.

An object of the present invention is to provide a moisture barrier laminate including a moisture trapping layer that maximizes its moisture trapping performance and exhibits an excellent moisture barrier property. The moisture barrier laminate of the present invention includes a gas barrier film substrate A having a gas barrier layer a1 and a moisture trapping layer B formed on the film substrate A as a base. On a surface of the moisture trapping layer B opposite to the film substrate A, a protective resin layer C having a moisture permeability in a range of 4.0×10 to 5.0×10.sup.4 g/m.sup.2.Math.day at 40° C. and 90% RH is laminated.

A laminate assembly includes a matrix layer and elongated, continuous strips of a conductive alloy. The matrix layer has opposite first and second sides connected by opposite first and second edges. Each of the first and second edges extends from the first side of the matrix layer to the opposite second side of the matrix layer. The elongated, continuous strips of the conductive alloy are disposed in the matrix layer between the first and second sides of the matrix layer. The elongated continuous strips continuously extend through the matrix layer from the first edge to the opposite second edge.

This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.