The purpose of the present invention is to provide a thermal conductor achieving both excellent light weight and excellent rigidity and also having excellent heat dissipation property. In order to achieve the above object, the thermal conductor according to the present invention has the following configuration. That is, a thermal conductor in which a sheet-shaped thermal conductive material (II) having an in-plane thermal conductivity of 300 W/m.Math.K or more is contained in a porous structure (I) configured of reinforcing fibers and a resin.

A laminate comprising a base material film, a resin layer (1) having a detachable surface, and a heat-generating conductive layer in this order.

The present application relates to a composite heat dissipation material. The composite heat dissipation material comprises at least one artificial graphite layer and a graphitic heat dissipation layer. The graphitic heat dissipation layer includes a graphite material layer, and the graphite material layer is not formed from artificial graphite materials. Further, the graphitic heat dissipation layer is bonded to the artificial graphite layer. The composite heat dissipation material of the present application can efficiently and rapidly dissipate heat energy produced from a heating source, thereby lowering temperature thereof.

A polyurethane film comprising a polyurethane resin and graphene, wherein the graphene is present in an amount of 1 to 30% by weight on the total weight of the film and consists of graphene nano-platelets, wherein at least 90% has a lateral dimension (x, y) of 50 to 50000 nm and a thickness (z) of 0.34 to 50 nm, wherein the lateral dimension is always greater than the thickness (x, y>z), wherein the C/O ratio is ≥100:1, and a preparation process thereof.

A treatment instrument including a heat transmitter that includes a treating surface and an installation surface, a substrate attached to the installation surface, and a heat generator formed on a surface of the substrate. The substrate surface and heat generator together form an uneven surface. First and second adhesion layers formed of a material having thermal conductivity and electrical insulation are provided between the installation surface and the substrate. The first adhesion layer is in close contact with the installation surface, and the second adhesion layer is in close contact with the heat generator and the substrate surface. The second adhesion layer is inserted into a recess in the uneven surface formed by the heat generator on substrate surface so as to increase the contact area between the second adhesion layer and the uneven surface.

The present invention relates to a method for manufacturing a silicon nitride substrate and, more specifically, comprises the steps of: forming a slurry by mixing silicon nitride powder, a ceramic additive, and a solvent; molding the slurry to form sheets; sandwiching at least one of the sheets between a lower plate and an upper plate to form a stacked structure; degreasing the stacked structure; and sintering the stacked structure. At least one of the lower plate and the upper plate comprises a plurality of protrusions provided on one surface thereof, and the protrusions extend in parallel to each other in one direction.

The present invention relates to a method for manufacturing a laminate, including: a laminating step of laminating a side of a thermal transfer layer of a thermal transfer sheet having a release sheet and the thermal transfer layer on at least a part of a surface of a resin member by heat bonding, in which the release sheet has no yield points, and has an elongation at break of 100% to 600% in a stress-strain curve measured by a tensile test at a molding temperature Tβ° C. in the laminating step.

An intermediate transfer body includes a base layer and a surface layer disposed on the base layer. The difference between the volume resistivity of the intermediate transfer body at an application voltage of 100 V, a temperature of 22° C., and a relative humidity of 55% and the volume resistivity of the intermediate transfer body at an application voltage of 500 kV, a temperature of 22° C., and a relative humidity of 55% is 2.0 log Ω.Math.cm or less. The difference between the volume resistivity of the intermediate transfer body at an application voltage of 500 kV, a temperature of 28° C., and a relative humidity of 85% and the volume resistivity of the intermediate transfer body at an application voltage of 500 kV, a temperature of 10° C., and a relative humidity of 30% is 1.0 log Ω.Math.cm or less.

Embodiments of the present invention encompass methods of forming a foamed polyolefin and articles and materials of the foamed polyolefin. The foamed materials and articles may be used in applications requiring thermal insulation.

A resin composition including: a thermosetting resin component including a mesogen; and a phosphorus atom-containing thermoplastic polymer type frame retardant, wherein the thermoplastic polymer type frame retardant is a phosphorous atom-containing formed by polymerizing or copolymerizing one of monomers represented by general formulae (1) and (2) below, ##STR00001## wherein, in the general formulae (1) and (2), each of R1 and R2 is any one of an alkyl group, an alkoxy group, an aryl group and an aryloxy group, R1 and R2 being different or identical, and R3 is a methyl group or a hydrogen atom.