In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

[Object]

To provide a multilayered polyester resin-coated metal sheet having respective performance of suppression of film cracks around a rivet portion arranged on a can lid (processability), suppression of resin delamination through retort processing after content filling (adhesion), and suppression of corrosion of a metal substrate after aging (corrosion resistance), all together at high levels, in addition to operability at the time of opening.

[Solving Means]

A multilayered polyester resin-coated metal sheet of the present invention has a metal substrate, a lower layer formed on at least one side of the metal substrate and made from a polyester resin (A) modified with 2 to 30 mol % of a first copolymerizable component, and an upper layer that is formed on the lower layer and that contains a polyester resin. (B) and a soft component (C) incompatible with the polyester resin (B), the soft component (C) being contained at a content of 2 to 50 mass % when the polyester resin (B) and the soft component (C) are assumed to amount to 100 mass % in total.

A laminated glass article includes a glass core layer and a glass cladding layer adjacent to the glass core layer. At least one of the glass core layer or the glass cladding layer is a tinted layer. The tinted layer can include a tinting agent that imparts a color to the tinted layer.

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Provided are a thermosetting resin composition, and a prepreg, a laminate and a printed circuit board using same. The thermosetting resin composition comprises a resin component comprising a modified cycloolefin copolymer and other unsaturated resins. The modified cycloolefin copolymer is a reaction product of maleic anhydride and a cycloolefin copolymer; the cycloolefin copolymer is a copolymerization product of a monomer A and a monomer B; the monomer A is selected from one of or a combination of at least two of norbornene, cyclopentadiene, dicyclopentadiene, tricyclopentadiene, and (I); and the monomer B is selected from one of or a combination of at least two of C2-C3 olefins and C2-C3 alkynes. The laminate prepared by using the provided thermosetting resin composition has good dielectric properties, peel strength and thermal resistance, and can satisfy the current requirements of properties for printed circuit board substrates in the field of high-frequency and high-speed communications.

Provided is a stretchable film including an elastomer layer, and a surface layer provided on any one or both of a first surface and a second surface of the elastomer layer, in which the surface layer contains one or more polypropylene-based resins selected from the group consisting of block polypropylene, which is a copolymer with ethylene, and random polypropylene, which is a copolymer with ethylene, and calcium carbonate, a content of the calcium carbonate in the surface layer is 10% to 75% by mass with respect to a total mass of the surface layer, a thickness of the elastomer layer is 20 μm to 55 μm, and a thickness of the surface layer is 0.4 μm to 5.0 μm.

Embodiments of the disclosure relate to a glass article. The glass article includes a glass sheet having a first major surface and a second major surface. The second major surface is opposite to the first major surface. The glass article also includes a frame made of a plastic material. The plastic material has a coefficient of thermal expansion (a) having units of ppm/° C. The glass article further includes an adhesive bonding the second major surface of the glass sheet to the frame. The adhesive has a shear modulus (G) having units of MPa. The plastic material of the frame and the adhesive are selected such that G≤500,000 α.sup.−3.

A combination of materials that may be formed through an extrusion process. The resulting product has at least two layers. By coextruding multiple layers of at least two types of materials together, the final product may have improved mechanical, thermal, electrical, and other properties as compared to the original materials used. Additionally, by using an additive, filler, or doping material in at least one layer of the final product during the extrusion process, the mechanical, thermal, electrical, or other properties of the final product may be further improved.

A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.

A resin composition contains: (A) an ethylene-vinyl alcohol copolymer; (B) an olefin polymer; and (C) a sorbic acid ester; wherein the sorbic acid ester (C) is present in an amount of 0.00001 to 10 ppm based on the weight of the resin composition. The resin composition exhibits reduced susceptibility to coloration.