A method of making an aquaplane is provided. The method includes flattening a fabric layer and a bottom layer with a waterproof characteristic, where the pull-string layer has a first pull-string layer, a second pull-string layer and multiple pull lines, one end of the pull line holds the first pull-string layer, and the other end of the pull line holds the second pull-string layer; using a roller laminates the fabric layer, the pull-string layer and the bottom layer, where a portion surface of the fabric layer and the bottom layer are melted, and respectively mixed with the surface gluing of the first pull-string layer and the second pull-string layer to produce a fixed microstructure; and cutting a shape of the aquaplane from the lamination of the fabric layer, the pull-string layer, and the bottom layer.

Enclosure parts for portable information handling systems may be made by heat pressing material layers together. The material layers may include outer fiber-reinforced thermoplastic layers and a core thermoplastic layer comprising a plurality of thermoplastic film layers. The core thermoplastic layer may be die cut to create voids that reduce weight of the enclosure part. A finishing layer may be added, along with attachment features.

A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.

The invention comprises a fracture film for sealing a peelable membrane to a container comprising a first layer of high density polyethelene, a second layer of polybutene-1/ethylene-vinyl acetate, wherein the second layer is bonded to the first layer, and a third layer of ethylene-acrylic acid, wherein the third layer is bonded to the second layer.

A substrate 2 of an adhesive tape 1 includes a mesh structure made of thermoplastic resin. The mesh structure has a structure in which multiple first fibers drawn in a first direction corresponding to a length direction of the adhesive tape and multiple second fibers drawn in a second direction corresponding to a width direction of the adhesive tape are layered or woven. (a) A first fiber has a thickness of 0.04 mm or less, and a width of 0.6 mm or less, (b) a second fiber has a thickness greater than that of the first fiber, and a width greater than or equal to that of the first fiber, (c) the mesh structure has a tensile strength in the first direction of from 130 to 250 N/50 mm, (d) the mesh structure has a bending resistance in the first direction obtained by a cantilever test of from 40 to 80 mm, and (e) the mesh structure has a bending resistance in the second direction obtained by the cantilever test of from 65 to 95 mm.

Disclosed are multilayer films which can provide desired film performance and balanced overall performance suited for various applications.

A method for forming a heat-reflective blank includes laminating at least one thermal film sheet at a predetermined position on a first linerboard sheet such that a laminated sheet is formed, and feeding the laminated sheet into a corrugating machine. The method further includes coupling the laminated sheet to a corrugated medium sheet and a second linerboard sheet such that a corrugated sheet is formed. The corrugated medium sheet is between the first linerboard sheet and the second linerboard sheet and the thermal film sheet is positioned on an outer surface of the corrugated sheet.

Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375 C. or higher when heated at an elevation rate of 20 C./min from 25 C., a solvent represented by the following General Formula (1) and having a boiling point of 160 C. or higher, and a solvent having a boiling point of lower than 120 C. In General Formula (1), R.sup.1 to R.sup.6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group. ##STR00001##

A heat spreading and insulating material using densified foam is provided that has a heat spreading layer that is adhered to an insulating layer. The material is designed to be used with mobile devices that generate heat adjacent to heat sensitive components. The insulating layer is formed from a compressed layer of polyimide foam to increase its density. The polyimide foam retains a significant amount of insulating properties through the densification process. In some embodiments, an EMI shielding layer is added to improve electrical properties of the device. The heat spreading layer is commonly a graphite material with anisotropic heat properties that preferentially conduct heat in-plane. The material may also include pressure sensitive layers to permanently apply the material to the mobile device.

[Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.

[Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf/cm.sup.2; and to cooling and solidification.