B32B2307/702

BMG parts having greater than critical casting thickness and method for making the same

The embodiments described herein relate to BMG articles with high bulk having all dimensions greater than the critical dimension. Exemplary BMG article can include at least one bulk component and/or one or more fixation elements configured on surface of the bulk component or inserted into the bulk component. Other embodiments relate to methods of making the BMG articles by thermo-plastic-formation of BMG alloy materials.

COMPOSITE STRUCTURES FOR PACKAGING ARTICLES AND RELATED METHODS
20170321380 · 2017-11-09 ·

The composite structure includes a fiber-containing layer, such as a fiberboard layer or other layer having fibers from natural and/or synthetic sources, and a mineral-containing layer covering the fiber-containing layer. The fiber-containing layer and mineral-containing layer can be shaped, sized and manufactured such that the composite structure formed therefrom is capable of being machined to form a storage article. The composite structure has advantages in that it can improve whiteness, opacity, ink adhesion, materials reduction, barrier properties, recyclability, and printability. The composite can reduce polymer mass requirements for heat seal, barrier, and fiber adhesion. Further improvements include economics, pliability, and flexibility that is increased over the pliability of the fiber-containing layer alone.

Plastic Laminate Structure and Touch Sensing Device Having the Same
20170320292 · 2017-11-09 ·

A plastic laminate structure including a plurality of, or a plurality of kinds of, plastic layers and an adhesive layer. The plastic layers are laminated together in a first direction. All the plastic layers are comprised exclusively of extruded plastic layers. The adhesive layer affixes together two of the plastic layers that are adjacent to each other in the first direction.

THERMALLY CONDUCTIVE AND PROTECTIVE COATING FOR ELECTRONIC DEVICE
20220044000 · 2022-02-10 · ·

A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal or amorphous structures, different crystalline orientations, different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

Multilayer film

Embodiments provide a multilayer film in which: a first acrylic resin layer (α1), an aromatic polycarbonate resin layer (β), and a second acrylic resin layer (α2) are directly laminated in the stated order; the aromatic polycarbonate resin constituting the aromatic polycarbonate resin layer (β) is a product of ester exchange between a polycarbonic acid ester of an aromatic dihydroxy compound and a low-crystalline or amorphous aromatic polyester; and the relationships (Tβ−Tα1)≤30 and (Tβ−Tα2)≤30 (where Tα1 is the glass transition temperature of the acrylic resin constituting the first acrylic resin layer (α1), Tα2 is the glass transition temperature of the acrylic resin constituting the second acrylic resin layer (α2), Tβ is the glass transition temperature of the aromatic polycarbonate resin constituting the aromatic polycarbonate resin layer (β), and all of the temperatures are measured in degrees Celsius) are satisfied. The glass transition temperature of the aromatic polycarbonate resin should be 100-140° C.

TRANSPARENT CONDUCTING FILM LAMINATE AND PROCESSING METHOD THEREOF
20220230774 · 2022-07-21 · ·

Provided are a transparent conducting film laminate to which a curl generated during a heating step and after the heating step can be controlled, and a method for processing the same. A transparent conducting film laminate comprises a transparent conducting film 20 and a carrier film 10 stacked thereon, wherein the transparent conducting film 20 comprises a transparent resin film 3, transparent conducting layer 4, and an overcoat layer 5 stacked in this order, the transparent resin film 3 having a thickness T.sub.1 of 5 to 25 μm and being made of an amorphous cycloolefin-based resin, the carrier film 10 is releasably stacked on the other main face, the face opposite to the face having the transparent conducting layer 4, of the transparent resin film 3 with an adhesive agent layer 2 therebetween, and a protection film 1 has a thickness T.sub.2 which is 5 times or more of the thickness T.sub.1 of the transparent resin film 3 and is 150 μm or less, and is made of polyester having an aromatic ring in its molecular backbone.

Biaxially oriented polyester film for metal lamination

The invention relates to a multilayer biaxially oriented polyester film comprising a base layer B, an amorphous outer layer A and a further outer layer C, where this polyester film is suitable for lamination with metal sheets. The invention in particular relates to a polyester film which comprises (based on the mass of polyester) from 2 to 15% by weight of isophthalate-derived units in the base layer and which comprises more than 19% by weight of isophthalate-derived units in the amorphous layer A, and which has a silane-based coating on the outer layer A. The invention further relates to a process for the production of these films.

THERMOPLASTIC RESIN LAMINATE

Provided is a thermoplastic resin laminate suitable for optical applications of transparent substrate materials and protective materials. The thermoplastic resin laminate includes a first layer including an amorphous polyester resin (A) as the main component, and a second layer including a (meth)acrylic resin (B) as the main component on the first layer.

Device modified substrate article and methods for making

A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

Composite material and resin composition containing metastable particles
11192985 · 2021-12-07 ·

A curable matrix resin composition containing a thermoset resin component and metastable thermoplastic particles, wherein the metastable thermoplastic particles are particles of semi-crystalline thermoplastic material with an amorphous polymer fraction that will undergo crystallization upon heating to a crystallization temperature T.sub.c. A fiber-reinforced polymeric composite material containing metastable thermoplastic particles is also disclosed.