A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.

A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient E.sub.MD in an MD direction at 120 C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient E.sub.TD in a TD direction at 120 C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

A technique comprising: providing an assembly temporarily adhered on opposite sides to respective carriers by respective adhesive elements, the assembly including at least one plastic support sheet; heating the assembly while mechanically compressing the assembly between the carriers, wherein the strength of adhesion of one of said adhesive elements to the respective carrier and/or to the assembly is partially reduced during said heating of the assembly under mechanical compression; and wherein the strength of adhesion of the said adhesive element to the carrier and/or to the assembly is further reducible by further heating the said adhesive element after partially or completely relaxing the pressure at which the assembly is mechanically compressed between the two carriers.

A decorative panel including a substrate material and a decorative top layer. The decorative top layer is formed by at least one timber layer penetrated with a cured adhesive, and the timber layer has a wood structure with collapsed vessels having opposed walls, the opposed walls being glued together permanently by the cured adhesive.

In some implementations, an electronic device includes a display stack to display content. The display stack can include a number of substrates coupled using a liquid optically clear adhesive (LOCA). In some implementations, the LOCA can have a modulus of elasticity of no greater than 80,000 Pa. Additionally, the display stack can be formed using a process that includes applying an external force to the display stack by placing the display stack between two fixtures. In an implementation, the external force can be applied while heating the display stack at a temperature of at least 60 C. and cooling the display stack according to a particular cooling rate.

A timber composite with timber layers and an adhesive matrix, wherein the timber layers include a wood grain with both summer wood grain and spring wood grain, wherein at least one surface of the timber composite includes raised portions and depressed portions, wherein the raised portions correspond to the summer wood grain and the depressed portions correspond to the spring wood grain.

A method for preparing a thermoplastic polyurethane film having a large thickness and excellent durability, and a thermoplastic polyurethane film prepared thereby are provided.

A coating and its application methods to coat at least one surface of a substrate, in particular cellulose-based substrates, and give it barrier properties to water, grease, oxygen, lights, moisture; heat resistance, a lower friction coefficient. The coating does not change the original properties of flexibility, biodegradability and recyclability of the original substrate. The coated substrate can be printed, can be recycled and exhibits unchanged properties in areas requiring folding of paper or cardboard.

An epoxy resin composition, a transparent composite material including the same, and a laminated board. The epoxy resin composition includes an epoxy resin A and an epoxy resin B. The refractive index of the epoxy resin A is 1.54-1.8 and the light transmittance of the epoxy resin A is 90%. The refractive index of the epoxy resin B is 1.54-1.8 and the light transmittance of the epoxy resin B is greater than 90%. The epoxy resin A is an organosilicon modified epoxy resin. The epoxy resin B is another type of epoxy resin. The organosilicon modified epoxy resin satisfying a specific condition and another type of epoxy resin also satisfying the specific condition are combined to form a specific epoxy resin composition. The composite material prepared from the epoxy resin composition, a curing agent, and a curing accelerator has the advantages of having high light transmittance and high bending strength, and also has high bonding strength.

A method of manufacturing a composite material may include providing one or more layers of reinforcement material penetrated with viscous matrix material that is doped with electrically conductive particles. The method may further include applying a magnetic field to arrange the particles into one or more electrically conductive pathways, and curing the matrix material to secure the pathways in position relative to the reinforcement material.