An apparatus is provided for indexing a layup mandrel for a composite part. The apparatus identifies a surface of a layup mandrel that travels in a process direction during fabrication of a composite part. A lamination head is in contact with the surface traversing the surface of the layup mandrel. A stream of 3D coordinates of the lamination head is acquired as the lamination head traverses the surface. The layup mandrel is characterized based on the stream of 3D coordinates. A Numerical Control (NC) program is alters such that a controller directs layup of fiber reinforced material at the layup mandrel based on a difference between the alignment of the layup mandrel and a nominal alignment of the layup mandrel.

A positive-electrode belt-shaped sheet is cut while the positive-electrode belt-shaped sheet and a negative-electrode belt-shaped sheet are continuously sent, a cut positive-electrode sheet laminated on the uncut negative-electrode belt-shaped sheet via a separator layer is sent and clamped, the uncut negative-electrode belt-shaped sheet is cut at a cutting gap between the positive-electrode sheets laminated thereon, so as to form a sheet unit including the positive-electrode sheet and the negative-electrode sheet, a lamination shape of the sheet unit is measured so as to determine good or bad of the lamination shape, the sheet unit is classified based on a good/bad determination result, and the sheet units determined as good products is collectively laminated and pressed so as to obtain a laminated electrode body. Here, the positive-electrode belt-shaped sheet is cut while the positive-electrode belt-shaped sheet is clamped.

A bonding apparatus includes a substrate holder holding the second substrate; a pusher pushing a back surface of the second substrate; a substrate support unit including a support talon supporting a circumferential edge portion of the first substrate to oppose the second substrate with a prescribed spacing between the second substrate and the circumferential edge portion of the first substrate; and a controller controlling a lifting/lowering operation of the pusher. The pusher pushes one prescribed point of the back surface of the second substrate, the one prescribed point corresponding to a position where a distance between a bonding surface of the first substrate and a bonding surface of the second substrate is shorter than a distance from the circumferential edge portion of the bonding surface of the first substrate to the bonding surface of the second substrate.

A laminating device, a processing method for the electrode plate assembly, and a thermally bonding device for electrode plates are provided. The laminating device includes a laminating platform, a first driving roller assembly, and a second driving roller assembly. A first spacing d1 is arranged between the first driving roller assembly and the second driving roller assembly. A length of each of the electrode plate units is L, d1 is less than L, or d1 is greater than L, and a ratio between d1 and Lis a non-integer.

The present invention relates to a method for manufacturing an electrode assembly. The method for manufacturing the electrode assembly comprises: a step (a) of transferring a plurality of radical units one by one from a first set position to a second position; a step (b) of measuring a distance between a full width end that is an end of the first electrode in a full width direction and a full width end that is an end of the second electrode in a full width direction; a step (c) of measuring a distance (B1) from a reference point (O) of the second set position to the full width end of the first electrode of the first radical unit; a step (d) of stacking the second radical unit on the first radical unit; a step (e) of measuring a distance (B2) from the reference point (O) of the second set position to the full width end of the first electrode of the second radical unit; a step (f) of measuring a distance (C1) between the full length end of the first electrode of the first radical unit and the full width end of the second electrode of the second radical unit by adding the distances (B2, A2) to each other and subtracting the distance (B1) from the sum of the distances (B2, A2); and a step (g) of comparing the distances (C1, A1) to each other to determine whether stacking is defective.

A processing and detecting apparatus configured to process and detect an object is provided and includes a carrying platform, a laser unit, a wavelength measuring unit, and a computing unit. The carrying platform is configured to carry the object, and the object includes a substrate and a plurality of micro light emitting diodes (LEDs) disposed on the substrate. The laser unit is configured to perform a working procedure on the object on the carrying platform and excite each of the micro LEDs to radiate a light signal. The wavelength measuring unit is configured to measure the light signal radiated by exciting each of the micro LEDs in real time to obtain a spectrum of each of the micro LEDs. The computing unit is configured to analyze the spectra of the micro LEDs to determine whether the working procedure is abnormal.

A laminating system includes, a plurality of film suppliers configured to be capable of supplying a film to be laminated on a sheet; and a laminating processor that laminates the film supplied from the film supplier onto the sheet. The film supplier that supplies the film can be switched.

The present invention relates to a substrate separation apparatus, and the substrate separation apparatus includes a separation member (310) that enters a bonded portion (12) of a bonded substrate (10) in which a first substrate (11) and a second substrate (13) are bonded, and forms a crack, a sensor module (200) configured to photograph the bonded substrate (10) and the separation member (310) to obtain measurement values corresponding to distances from the sensor module (200) to the bonded substrate (10) and the separation member (310), and a processor (100) configured to move the separation member (310) to a height of the bonded portion (12) on the basis of the measurement values.

Embodiments of the present disclosure provide an automatic production line for gluing and laminating, a method, a system and medium for gluing and laminating. The automatic production line includes at least one production line unit and a central control processor. The at least one production line unit includes a gluing unit, a laminating unit, a baking unit, a pressing unit, or an image acquisition unit. The central control processor is configured to: determine, based on an image data set, gluing quality data, wherein the image data set includes an original image data set and a gluing image data set; determine, based on the gluing quality data, at least one control parameter; generate, based on the at least one control parameter, a control instruction, and send the control instruction to the at least one production line unit to perform a production control.

According to some embodiments, provided is a separation system configured to separate a bonded substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The separation system includes a first chuck configured to hold the first substrate of the bonded substrate. The separation system includes a second chuck configured to hold the second substrate of the bonded substrate and move the second substrate in a first direction away from a plate surface of the first substrate. The separation system includes an adjuster configured to adjust a tilt of the second chuck with respect to a direction perpendicular to a set line set on a holding surface of the second substrate of the second chuck. The separation system includes a controller configured to operate the adjuster to maintain symmetrical progression of the separation relative to the set line.