A positive transport of carbon fiber bundles, in ribbon form, with in-line manipulation of the fiber bundles (spreading or spreading and volumization with manipulators) during fiber bundle transport to points of fiber bundle deliveries into the circular loom bed plate turntable is described herein. The automated placements of these deliveries of the fiber bundle/tow at selected orientations in the area correspond to the feeding zone of an improved circular loom bed plate turntable.

A positive transport of carbon fiber bundles, in ribbon form, with in-line manipulation of the fiber bundles (spreading or spreading and volumization with manipulators) during fiber bundle transport to points of fiber bundle deliveries into the circular loom bed plate turntable is described herein. The automated placements of these deliveries of the fiber bundle/tow at selected orientations in the area correspond to the feeding zone of an improved circular loom bed plate turntable.

A composite foam article is disclosed herein. The composite foam article comprises a polyurethane foam core presenting a first surface and a second surface facing opposite the first surface. A first skin is disposed on the first surface and a second skin is disposed on the second surface. The first and second skins comprise a plurality of fibers and a polymeric binder. The composite foam article also comprises at least one supplemental layer comprising an ethylene and acrylic acid copolymer dispersed in and/or disposed between any of said aforementioned skins and core.

The present disclosure provides, among other things, surface coverings with a protective coat applied thereto a rubber material. As provided herein, in some embodiments, a surface covering has or includes an exposed surface that is no-wax. The present disclosure further provides methods of making, and methods of using. Such surface coverings have surprising and beneficial attributes. They are particularly advantageous as resistant to soiling and abrasion. These surface covering are also resistant to crumbling under load. Such surface coverings would be useful as flooring products with desirable properties. In particular, such abrasion and soil resistant surfaces could be useful as a rubber flooring product.

The present invention concerns a sponge including a layer of an absorbent material and a layer of a textile material made of microfibers and strengthened by a binding agent, said textile layer at least partially covering one or more of the surfaces of the layer of absorbent material.

A non-provisioned card having a front side and a back side, and at least one visible surface that is patinated or activated to promote patination.

A non-provisioned card having a front side and a back side, and at least one visible surface that is patinated or activated to promote patination.

Interfacial delamination processes for physically separating a film structure from a substrate, and processes of fabricating a thin-film electronic device. The processes entail providing the substrate with an electrically-conductive separation layer on a surface of the substrate and optionally providing a pin hole free barrier layer on the electrically-conductive separation layer, forming a film structure on the electrically-conductive separation layer or, if present, the barrier layer, to yield a multilayer structure, and separating the film structure from the substrate by subjecting the multilayer structure to interfacial debonding that comprises contacting at least an interface between the film structure and the electrically-conductive separation layer or, if present, the barrier layer, with water or an electrolyte solution.

Aspects of the present disclosure provide for composite structures including a bonding layer that adheres a substrate (e.g., including a polymeric composition such as rubber) to a material (e.g., including a polymer such as polyurethane). The adhesion of the substrate to the material through the bonding layer can include chemical bonds such as, but not limited to, siloxane linkages, silanol linkages, silyl linkages, or any combination thereof in the bonding layer.