A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.

A process for the manufacture of a colored laminated glazing including at least two glass sheets connected together by a thermoplastic interlayer, includes deposition, by the liquid route, on a first glass sheet, of a polymeric layer including a coloring agent and polymeric compounds, drying and optionally curing of the polymeric layer, assembling of the glass sheet, coated with the colored polymeric layer, with a colorless transparent thermoplastic interlayer and with the second glass sheet, so that the colored polymeric layer is in direct contact with the interlayer, degassing, during which the air trapped between the glass sheets and the thermoplastic interlayer is removed, and heat treatment under pressure and/or under vacuum of the laminated glass at a temperature of between 60 and 200° C., during which the coloring agent present in the polymeric layer migrates toward the thermoplastic interlayer and during which the laminated glazing is assembled.

Methods of rapidly debonding encapsulant in solar modules and disassembling the modules for reuse or recycling of components. Electromagnetic radiation is applied to a solar module in a temperature and humidity-controlled environment to debond the encapsulant layers. Peel blocks are used to separate the front layer and back sheet of the module from the solar cells. The components are then sorted for reuse or recycling of valuable materials. The embodiments described also include a system of performing the methods that can be arranged in one or more shipping containers to be delivered to a solar module decommissioning site.

A method and an apparatus for producing a relief-pattern forming, the method and apparatus being suitable for producing a film-like material, such as an embossed film, having a fine relief-structure pattern formed on a surface thereof so as to have a distinctive optical effect with higher quality, good productivity, and fewer defects. A transfer pattern printed layer having an inverted structure of a relief-structure pattern is formed on a second substrate by printing a transfer pattern onto the surface of a first substrate on which the relief-structure pattern is formed at a predetermined position by registration with the relief-structure pattern followed by drying, laminating with the second substrate, curing and peeling.

A building board having an integral vapor-permeable water-resistant barrier (WRB) sheet, and a process for making same, and a two-material layered laminate useful for making said building board, wherein the building board comprises in order, a WRB sheet, a polymer tie layer, and a board substrate bonded together in a face-to-face relationship, the polymer tie layer comprising of a thermally or high frequency activated fibrous web and having voids through the thickness of said layer such that the polymer tie layer has a moisture vapor transmission rate through said layer of at least equal to or greater than that of the WRB sheet, the polymer of the polymer tie layer having an elastic modulus (G′) greater than 1×10.sup.6 Pa at 20° C. and a softening temperature of greater than 122° F. (50 C), the softening temperature being the temperature at which the polymer elastic modulus (G′) drops below 30 percent of the elastic modulus (G′) of the polymer at 20° C.; and wherein the moisture vapor permeability through the building board is 5 perms or greater.

A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.

Provided is a method for manufacturing a laminated film that can be molded into a complicated shape. A method for manufacturing a laminated film comprising: a step of forming an uncured hard coat layer by applying an active energy-ray curable composition for forming a hard coat layer to one side of a first support substrate having a thickness of 50 μm or more and 600 μm or less, and then drying the composition; a step of forming an uncured optical interference layer by applying an active energy-ray curable composition for forming a optical interference layer on one surface of a second support substrate so that the thickness of the uncured optical interference layer is between 15 nm or more and 200 nm or less, and then drying the composition; and a lamination step of laminating a surface of the uncured hard coat layer opposite the first support substrate and a surface of the uncured optical interference layer opposite the second support substrate to obtain a laminated film, wherein a stretch ratio of the laminated film at 160° C. is 50% or more.

Electrochemical cells, and more specifically, release systems for the fabrication of electrochemical cells are described. In particular, release layer arrangements, assemblies, methods and compositions that facilitate the fabrication of electrochemical cell components, such as electrodes, are presented. In some embodiments, methods of fabricating an electrode involve the use of a release layer to separate portions of the electrode from a carrier substrate on which the electrode was fabricated. For example, an intermediate electrode assembly may include, in sequence, an electroactive material layer, a current collector layer, a release layer, and a carrier substrate. The carrier substrate can facilitate handling of the electrode during fabrication and/or assembly, but may be released from the electrode prior to commercial use.

A method for thinning a fingerprint identification module includes the steps of: providing at least one fingerprint identification module, wherein the fingerprint identification module includes a glass substrate and a plurality of laminated fingerprint identification members; providing a protective layer on each laminated fingerprint identification member; providing a dissociable sealant around each laminated fingerprint identification member and the protective layer of the fingerprint identification module and being adhered to support plate to form a carrier plate to be etched; etching the carrier plate to be etched and allowing an etching solution to etch the glass substrate until a thickness to be thinned is etched to form a semi-finished carrier plate; dissociating the dissociable sealant of the semi-finished carrier plate to reduce its viscosity; and removing the support plate, the dissociable sealant and the protective layer to complete a finished product of the thinned fingerprint identification module.

The disclosure provides post-production methods for functionalization of optical quality films produced by top tier manufactures. The methods disclosed herein allow for the incorporation of different additives into existing films.