Provided is: a curing reactive silicone composition having sufficient toughness and pressure sensitive adhesive strength to temporarily secure various substrate even in an uncured state, having heat meltability and excellent moldability of a sheet or the like, and that can be quickly cured by high energy irradiation to achieve high adhesive strength; a method of manufacturing a sheet thereof a cured product thereof that can achieve high adhesive strength by crimping; and applications thereof. The curing reactive silicone composition comprises: (A) an MQ resin; (B) a chain organopolysiloxane having at least two groups containing an aliphatic unsaturated carbon-carbon bond, and a degree of siloxane polymerization within a range of 80 to 3000; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst activated by a high energy beam. The amount of component (A) is more than 55 mass % and less than 90 mass % of the sum of components (A) to (C).

The present disclosure discloses a support film, an OLED display structure and a manufacturing method thereof The support film includes a first adhesive material layer and a first base material layer, which are stacked together, and a first release film therebetween.

A flexible substrate and a manufacturing method thereof and a display device are provided. The flexible substrate has a bending region. The flexible substrate includes a base substrate, and a first organic layer and a second organic layer which are sequentially laminated on the base substrate, and a surface where the first organic layer contacts the second organic layer in the bending region includes a concave-convex structure.

The present invention relates to a luminous vehicle sunroof that includes a first glazing with first and second main faces, a light-emitting element such as an OLED or QLED and a collimating optical system with one or more optical films.

A barrier film for electronic devices exhibiting and maintaining excellent water barrier property. The barrier film for electronic devices features a water permeability (23° C., RH50%) that is set to be not more than 10.sup.−4 g/m.sup.2/day and a water content that is maintained to be not more than 2000 ppm.

A display device includes a display panel including a folding area and a non-folding area which is adjacent to the folding area, a support member facing the folding area and the non-folding area of the display panel and having a total planar area, and a light shielding layer between the display panel and the support member and having a total planar area which is smaller than the total planar area of the support member.

Disclosed is an organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed on the substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate.

A method of bonding layers of dielectric materials includes providing a surface one of the layers with microscale- and/or nanoscale-size bonding elements forming contact points of the layers and bringing a layer of the layers into a mutual position according to an intended use. The method also includes illuminating the layer whose surface is provided with bonding elements by an incident electromagnetic wave, the propagation direction of which is substantially orthogonal to the one of the layers, and whose wavelength is selected depending on an absorption spectrum of a material forming the one of the layers and generating condensed optical beams within said bonding elements or close to a tip of said bonding elements intended to be in contact with the other layer. The method further includes heating and melting the bonding elements by high-intensity focal spots formed by said generated optical beams and maintaining the layers into a mutual position until and bonding of the layers.

A method of fabricating a flexible organic light-emitting diode (OLED) display panel, the method comprising the steps of: step S1, providing a rigid substrate on which a flexible base is formed; step S2, forming a thin film transistor array layer on the flexible base; step S3, forming an OLED display unit on the thin film transistor array layer; step S4, forming an encapsulation layer on the OLED display unit; step S5, forming a protective layer on the encapsulation layer, wherein the protective layer is adhered to a surface of the encapsulation layer away from the OLED display unit by a thermal sensitive adhesive; step S6, peeling off the rigid substrate, and completing a support film to be attached under the flexible base; step S7, removing the protective layer; and step S8, forming a protective cover on the encapsulation layer.

A display film includes a transparent polymeric substrate layer and a transparent energy dissipation layer disposed on the transparent polymeric substrate layer. The transparent energy dissipation layer includes cross-linked polyurethane and a polyacrylate polymer. The transparent energy dissipation layer has a glass transition temperature of 27 degrees Celsius or less and a Tan Delta peak value of 0.5 or greater.