Patent classifications
B41F15/0881
Apparatus and method of generating control parameter of screen printer
An apparatus, a recording medium, and a method for generating a control parameter of a screen printer are disclosed. The apparatus includes a memory that stores a simulation model configured to derive predictive inspection information on a printed state of solder paste based on a plurality of control parameters of the screen printer; a communication circuit configured to receive first inspection information on a plurality of solder pastes printed by the screen printer based on a first control parameter, and a processor electrically connected to the memory and the communication circuit. The processor obtains first predictive inspection information by applying the first control parameter to the simulation model, generates a plurality of candidate control parameters based on the first predictive inspection information, determines a plurality of second control parameters among the candidate control parameters, and transmits the plurality of second control parameters to the screen printer via the communication circuit.
SOLDER PASTE BEAD RECOVERY SYSTEM AND METHOD
A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.
Printing device
A printing device includes a coating material scooping unit configured to scoop a coating material on a mask, and a controller configured or programmed to determine whether or not the coating material scooping unit performs collecting operation to collect the coating material on the mask when the mask is replaced.
Systems for printing solder paste and other viscous materials at high resolution
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
PRINTING PARAMETER ACQUISITION DEVICE
A printing parameter acquisition device includes an acquisition section and an output section. The acquisition section acquires a printing condition for specifying a member to be used when solder is printed on a board. The output section outputs a printing parameter which is associated with a printing condition corresponding to a printing condition acquired by the acquisition section and of which a reliability is a predetermined level or more, from a database that stores the printing condition, a printing parameter used for controlling driving of a printer, and the reliability of the printing parameter including inspection information on a print state of the solder inspected by a printing inspector in association with each other.
VACUUM WIPER AND STENCIL PRINTER WITH VACUUM WIPER
A vacuum wiper, comprising a housing, a connection port, multiple holes and a hole adjusting means; the housing contains a cavity; the connection port is disposed on the housing and is in communication with the cavity; the multiple holes are disposed on the housing in the length direction of the housing, such that the cavity of the vacuum wiper housing is able to be in fluid communication with the outside via the multiple holes. The vacuum wiper has a maximum vacuumizing length when all of the multiple holes are in communication with the outside. The hole adjusting means is configured to be capable of blocking one or more of the multiple holes in sequence from two ends in the length direction of arrangement of the multiple holes of the vacuum wiper, such that the vacuum wiper is able to adjust the vacuumizing length. The provision of the hole adjusting means enables the vacuum wiping apparatus to have an adjustable vacuumizing length, in order to match the wiping of stencils with different length specifications, thereby effectively increasing the vacuumizing efficiency of the vacuum wiping apparatus and reducing the production cost.
Screen printing apparatus, mask cleaner, and blade
A screen printing apparatus includes a print head, a moving base, and a mask cleaner. The print head prints a paste onto a board through the mask. The moving base moves under the mask in a horizontal paste scraping direction. The mask cleaner is mounted to the moving base and moves under the mask integrally with the moving base, and scrapes off the paste adhering to a lower surface of the mask. A base body is mounted to the moving base and includes a longitudinal side being horizontal and intersecting the paste scraping direction. Plurality of blades are detachably mounted to the base body and extending in the longitudinal direction and are arranged side by side in parallel to the paste scraping direction and cause a paste scraping edge protruding upward from the base body to come into abutment against the lower surface of the mask.
Screen printing method and screen printing machine
A screen printing method of the present disclosure includes: a step of performing printing of a first viscous fluid through a screen on the first circuit board using a first squeegee and a first holding member; and a step of performing printing of a second viscous fluid through the screen on the second circuit board using a second squeegee and a second holding member. As described above, in the printing of the first viscous fluid on the first circuit board and the printing of the second viscous fluid on the second circuit board, squeegees and holding members different from each other are used, and thus, the first viscous fluid and the second viscous fluid do not mix with each other. As a result, it is possible to perform printing of different types of viscous fluids on the first circuit board and the second circuit board.
Screen printing apparatus
A screen printing apparatus includes a squeegee driver that lifts/lowers a first lifting/lowering shaft and a second lifting/lowering shaft; a link mechanism including a swinging member that pivots about a horizontal axis by lifting/lowering operations of the first lifting/lowering shaft and the second lifting/lowering shaft; a squeegee unit installed to the swinging member; and a controller that controls at least a height of the squeegee unit and an orientation of the squeegee unit in a rotating direction by controlling the squeegee driver.
Printing device and printing method
A solder paste printer for which a pressing force of squeegee towards a stencil when spreading solder paste is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.