A method is disclosed for electroforming metal screen. The method deposits photoresist over a mandrel, and then exposes the photoresist with light through a plurality of openings in a photo tool to form hardened resist pillars. Unexposed photoresist is removed without affecting the resist pillars. The method then electroforms the metal screen in areas free of the hardened resist pillars such that the metal screen forms apertures defined by each of the resist pillars, a space between at least two of the resist pillars defining a support bar that forms at a reduced thickness as compared to portions of the metal screen that are not between the resist pillars. Finally, the method detaches the metal screen from the mandrel.

A screen unit for a printing device for printing three-dimensionally shaped structures, in particular on substrates, printed circuit boards, wafers, solar cells, carrier substrates, printing tables, carrier plates, sintering plates or the like, has a frame holding at least one printing screen and is designed to be accommodated in a screen receptacle of the printing device, to be filled with a printing compound and to be subjected to the action of a squeegee for carrying out a printing process. The screen unit has, in or on the frame, at least one holding device for the squeegee, which is in the form of an exchangeable squeegee.

A screen unit for a printing device for printing three-dimensionally shaped structures, in particular on substrates, printed circuit boards, wafers, solar cells, carrier substrates, printing tables, carrier plates, sintering plates or the like, has a frame holding at least one printing screen and is designed to be accommodated in a screen receptacle of the printing device, to be filled with a printing compound and to be subjected to the action of a squeegee for carrying out a printing process. The screen unit has, in or on the frame, at least one holding device for the squeegee, which is in the form of an exchangeable squeegee.

A composite stencil for applying designs to walls and other surfaces is disclosed. The stencil includes a porous textile support layer to which a flexible stencil mask is bonded by an adhesion layer. The support layer supports unconnected parts of the stencil mask without bridges common with traditional stencils. Further, the textile support layer in the open areas of the stencil can be colored with a sublimation dye to suggest to a user the colors that should be applied in the various areas of the stencil. A pressure sensitive adhesive is applied to the back of the stencil. In use, the stencil is removably adhered to a surface by the pressure sensitive adhesive, whereupon paint or other pigment is applied through the textile support layer to the surface. The lack of bridges permits the entire design to be applied with a single stencil in a single session. The stencil is cleanable and reusable to apply additional designs.

A composite stencil for applying designs to walls and other surfaces is disclosed. The stencil includes a porous textile support layer to which a flexible stencil mask is bonded by an adhesion layer. The support layer supports unconnected parts of the stencil mask without bridges common with traditional stencils. Further, the textile support layer in the open areas of the stencil can be colored with a sublimation dye to suggest to a user the colors that should be applied in the various areas of the stencil. A pressure sensitive adhesive is applied to the back of the stencil. In use, the stencil is removably adhered to a surface by the pressure sensitive adhesive, whereupon paint or other pigment is applied through the textile support layer to the surface. The lack of bridges permits the entire design to be applied with a single stencil in a single session. The stencil is cleanable and reusable to apply additional designs.

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

An apparatus that communicates with a screen printer and a solder inspection device is disclosed. The apparatus according to the present disclosure may include a process that is configured to: obtain first information associated with each of a plurality of pads on the substrate; obtain second information associated with each piece of the solder paste applied to each of the plurality of pads from the solder inspection device; determine a position correction value for the stencil mask with respect to the substrate based on the first information and the second information; and deliver the position correction value to the screen printer.

A stencil printer includes a frame, a stencil coupled to the frame, and a support assembly coupled to the frame, with the support assembly including tooling configured to support the electronic substrate in a print position beneath the stencil. The stencil printer further includes a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a squeegee blade assembly and at least one paste cartridge to deposit solder paste on the stencil. The stencil printer further includes an end effector configured to pick up and release items from a tooling tray. The stencil printer further includes a movable cart configured to interface with the stencil printer to deliver changeover and/or replacement items within a stencil printer.

A stencil printer includes a frame, a stencil coupled to the frame, and a support assembly coupled to the frame, with the support assembly including tooling configured to support the electronic substrate in a print position beneath the stencil. The stencil printer further includes a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a squeegee blade assembly and at least one paste cartridge to deposit solder paste on the stencil. The stencil printer further includes an end effector configured to pick up and release items from a tooling tray. The stencil printer further includes a movable cart configured to interface with the stencil printer to deliver changeover and/or replacement items within a stencil printer.

A printing apparatus includes a base frame being bridged between a pair of legs and being configured to support a printing unit, and a board box being arranged under the base frame and being configured to accommodate a control board. A hook is provided to any one surface of a lower surface of the base frame and an upper surface of the board box, and a hole engageable with the hook is provided in the other surface. A female screw is formed in any one side surface of a side surface of the base frame and a side surface of the board box, and a fixing member configured to abut against the one side surface is provided to the other side surface. The board box is fixed to the base frame by a male screw screwed into the female screw through intermediation of the fixing member.