An applicator for transferring an indicia to a substrate includes an ink layer forming the indicia. A white layer is disposed on the ink layer. An adhesive layer is disposed on the white layer. The adhesive layer is configured to adhere the ink layer and the white layer to the substrate.

An applicator for transferring an indicia to a substrate includes an ink layer forming the indicia. A white layer is disposed on the ink layer. An adhesive layer is disposed on the white layer. The adhesive layer is configured to adhere the ink layer and the white layer to the substrate.

The present disclosure is directed to a rotary screen printing apparatus, comprising: a rotary cylindrical screen; a conduit which provides fluid communication to an internal volume of the rotary cylindrical screen; and, a heater whose output is directed towards the conduit.

The present disclosure is directed to a rotary screen printing apparatus, comprising: a rotary cylindrical screen; a conduit which provides fluid communication to an internal volume of the rotary cylindrical screen; and, a heater whose output is directed towards the conduit.

The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

A screen printing device and a screen printing method are provided. The screen printing device includes a screen plate and an electrifying device, the screen plate includes a conductive mesh; and the electrifying device is electrically connected with the conductive mesh and configured to apply voltage to the conductive mesh. The screen printing method includes: adopting a printing head to rub against a screen plate to print ink onto a substrate for silk screen printing, wherein the screen plate includes a conductive mesh; and applying voltage with positive or negative polarity to the conductive mesh in the screen printing process.

A screen printing device and a screen printing method are provided. The screen printing device includes a screen plate and an electrifying device, the screen plate includes a conductive mesh; and the electrifying device is electrically connected with the conductive mesh and configured to apply voltage to the conductive mesh. The screen printing method includes: adopting a printing head to rub against a screen plate to print ink onto a substrate for silk screen printing, wherein the screen plate includes a conductive mesh; and applying voltage with positive or negative polarity to the conductive mesh in the screen printing process.

An applicator for transferring an indicia to a substrate includes an ink layer forming the indicia. A white layer is disposed on the ink layer. An adhesive layer is disposed on the white layer. The adhesive layer is configured to adhere the ink layer and the white layer to the substrate.

An applicator for transferring an indicia to a substrate includes an ink layer forming the indicia. A white layer is disposed on the ink layer. An adhesive layer is disposed on the white layer. The adhesive layer is configured to adhere the ink layer and the white layer to the substrate.