A paste supply apparatus includes a pot holding part that holds a paste pot that includes a tubular container which receives paste and is provided with a through hole in a bottom part of the tubular container and an inner lid movable inside the tubular container, in a posture in which the paste can be extruded downwardly from the through hole, an extrusion member configured to hold the inner lid of the paste pot held in the pot holding part, an inner lid holding part with which the inner lid is held in the extrusion member, an extrusion member elevation part that upwardly and downwardly moves the extrusion member, and a stopper with which the container upwardly moved together with the inner lid collides when the extrusion member holding the inner lid is pulled up by the extrusion member elevation part.

A method of dispensing paste for a printer using a paste dispensing apparatus is provided. The paste dispensing apparatus includes a reservoir for storing a paste for a printer. The reservoir includes a stirrer for stirring the paste. The paste dispensing apparatus includes a receptacle for receiving paste from the reservoir. The paste dispensing apparatus includes a closable passage from the reservoir to the receptacle. The closable passage is changeable between an open state and a closed state. In the open state, the receptacle is fluidly coupled to the reservoir so that paste can pass from the reservoir to the receptacle. In the closed state, the receptacle is fluidly decoupled from the reservoir so that the paste is prevented from passing from the reservoir to the receptacle. The paste dispensing apparatus includes a pusher for pushing paste out of the receptacle. The method includes transferring a first volume of paste from the reservoir to the receptacle while the closable passage is in the open state. The method includes, after the transferring, changing the closable passage from the open state to the closed state. The method includes, after the changing, performing a first discharging operation by the pusher to discharge a first amount of paste from the receptacle while the closable passage is in the closed state.

A method of dispensing paste for a printer using a paste dispensing apparatus is provided. The paste dispensing apparatus includes a reservoir for storing a paste for a printer. The reservoir includes a stirrer for stirring the paste. The paste dispensing apparatus includes a receptacle for receiving paste from the reservoir. The paste dispensing apparatus includes a closable passage from the reservoir to the receptacle. The closable passage is changeable between an open state and a closed state. In the open state, the receptacle is fluidly coupled to the reservoir so that paste can pass from the reservoir to the receptacle. In the closed state, the receptacle is fluidly decoupled from the reservoir so that the paste is prevented from passing from the reservoir to the receptacle. The paste dispensing apparatus includes a pusher for pushing paste out of the receptacle. The method includes transferring a first volume of paste from the reservoir to the receptacle while the closable passage is in the open state. The method includes, after the transferring, changing the closable passage from the open state to the closed state. The method includes, after the changing, performing a first discharging operation by the pusher to discharge a first amount of paste from the receptacle while the closable passage is in the closed state.

A stencil printer includes a frame, a stencil, a support assembly, and a print head, and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The support assembly supports the electronic substrate in a print position beneath the stencil. The print head assembly includes a print head a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a cover coupled to the frame to enclose operating components of the stencil printer, including the stencil, the support assembly, the print head gantry and the print head assembly. The cover includes an elongate opening formed therein and a movable door configured to selectively close the elongate opening. The elongate opening is sized to enable the stencil and/or a tooling tray to pass through.

A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.

A system for forming a particle layer on a substrate may include at least one sprayer and at least two masks configured to selectively mask a substrate in a first region and second region of the substrate. The at least one sprayer may be configured to spray particles at the substrate, where the at least two masks maintain the first region and second region substantially free of the deposited material. A heater may be employed to heat the substrate as the particles are sprayed by the at least one sprayer onto the substrate.

Described are systems, methods, devices, apparatuses, and materials suitable for fabricating flexible microcavity structures and integrating flexible microcavity structures into multi-functional flexible hybrid electronics and electronic components, as well as systems, devices, apparatuses, methods, and computer program products for screen-printing flexible microcavity structures and for integrating flexible microcavity structures into multi-functional flexible hybrid electronics.

The present disclosure provides a solder paste tube assembly device, a printing machine comprising same and a solder paste tube assembly method. The solder paste tube assembly device is used for securing and sealing a solder paste tube, in which a nozzle is arranged at the bottom of the solder paste tube, and the solder paste tube provides a solder paste by means of the nozzle, the solder paste tube assembly device comprises a support, a top sealing device and a bottom support device, the top sealing device is configured to controllably ascend and descend for connecting to the top of the solder paste tube at different heights in a sealing manner. The solder paste tube assembly device of the present disclosure can automatically complete the disassembly and replacement of the solder paste tubes and can automatically replace the solder paste tubes of different heights by means of the top sealing device capable of automatically ascending and descending.

Examples include a machine for handling sheets including an inspection device for inspecting sheets and at least one sheet transport means, which defines a section of a transport path that is provided for the sheets, and which includes an inspection region. In an inspection position, a sensor device of the inspection device is arranged so as to be aligned with the inspection region. At least one guide device of the at least one sensor device is provided, which defines a sensor adjustment path that is provided for movement of the sensor device and that extends from the inspection position at least to a first backed-away position configured as a maintenance position. The sensor adjustment path extends orthogonal with respect to a transverse direction, and at least between the inspection position and the first backed-away position.

Examples include a machine for handling sheets including an inspection device for inspecting sheets and at least one sheet transport means, which defines a section of a transport path that is provided for the sheets, and which includes an inspection region. In an inspection position, a sensor device of the inspection device is arranged so as to be aligned with the inspection region. At least one guide device of the at least one sensor device is provided, which defines a sensor adjustment path that is provided for movement of the sensor device and that extends from the inspection position at least to a first backed-away position configured as a maintenance position. The sensor adjustment path extends orthogonal with respect to a transverse direction, and at least between the inspection position and the first backed-away position.