Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

The object of this invention is to transfer, fix and polish images produced by: toner laser printers or inkjet printers, flexographic technology, silkscreen technology, offset technology, printed on reel support (A), on the plastic or metal surface of three-dimensional objects (16), thanks to which it is possible to detach images from the reel support (A) and subsequently transfer them to the surface of said plastic or metal objects (16) by a thermomechanical (1, 10) action.

Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.

A retransfer printing process that prevents dust and other contaminants from becoming statically or otherwise attached to the transfer layer of the retransfer film and/or to the print ribbon used to print on the retransfer film. In the described process, some or all of the unused retransfer film is rewound back onto the retransfer film supply and/or some or all of the unused print ribbon is rewound onto the print ribbon supply, for example until the next print job is submitted.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

A head pressurizing mechanism in which in a state in which a first tape cartridge is mounted, a first contact pin is positioned at a first switching position in which the first contact pin comes in contact with a pressure receiving portion provided on a side of a thermal head opposite a platen roller, and in a state in which the second tape cartridge is mounted, by pushing the pressurizing position switching portion in a mounting direction with the second tape cartridge, a second contact pin is positioned at a second switching position in which the second contact pin comes in contact with the pressure receiving portion at, with respect to the first switching position, a portion in a direction opposite the mounting direction.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

Methods, apparatus and system for decorating plastic articles having an uneven surface or hollow structure are disclosed. An assembly comprising a transfer pad and a flexible heat transfer die comprising a thermal interface material (TIM) replace the hard rubber die in a hot-stamping process to fuse indicia into the surface. The assembly modifies ordinary pad printing into a hot-stamping process that transfers indicia onto uneven surfaces. A pad printing machine or other robotics is used to move the assembly from a position of heating to a position of compressing the ink transfer to the surface of the article.

Technologies are generally provided for textile items with breathable heat transfer labels. In some examples, a reversed design of a label may be printed onto a surface of a carrier using a water-based or solvent-based ink. A layer of a thermoplastic adhesive may be applied onto the surface of the carrier with the reversed design and a predefined pattern of holes may be laser-drilled into the carrier through the thermoplastic adhesive to avoid appearance of burn marks on an external surface of the label in the completed product. The carrier may be onto a garment or textile item by affixing the thermoplastic adhesive onto a surface of the garment and activating the thermoplastic adhesive. The carrier may then be removed revealing the design of the label with laser-drilled holes on the garment or textile item.

Methods, apparatus and system for decorating plastic articles having an uneven surface or hollow structure are disclosed. An assembly comprising a transfer pad and a flexible heat transfer die comprising a thermal interface material (TIM) replace the hard rubber die in a hot-stamping process to fuse indicia into the surface. The assembly modifies ordinary pad printing into a hot-stamping process that transfers indicia onto uneven surfaces. A pad printing machine or other robotics is used to move the assembly from a position of heating to a position of compressing the ink transfer to the surface of the article.