A retransfer printing process that prevents dust and other contaminants from becoming statically or otherwise attached to the transfer layer of the retransfer film and/or to the print ribbon used to print on the retransfer film. In the described process, some or all of the unused retransfer film is rewound back onto the retransfer film supply and/or some or all of the unused print ribbon is rewound onto the print ribbon supply, for example until the next print job is submitted.

A first movable body is provided movably in a separation direction and a first engaging member is provided for each suction unit. When the first movable body is moved in the separation direction, the plurality of first engaging members are respectively engaged with the first movable body in the same sequence as an array sequence of the suction units. Thereafter, the suction units are moved in the separation direction together with the first movable body.

The object of this invention is to transfer, fix and polish images produced by: toner laser printers or inkjet printers, flexographic technology, silkscreen technology, offset technology, printed on reel support (A), on the plastic or metal surface of three-dimensional objects (16), thanks to which it is possible to detach images from the reel support (A) and subsequently transfer them to the surface of said plastic or metal objects (16) by a thermomechanical (1, 10) action.

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed. In yet another aspect, a method and structure for heat-assisted micro-transfer printing is disclosed.

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

A safe, integrated dye sublimation printer apparatus is disclosed. The apparatus is configured to print one or more images. In some embodiments, the apparatus may be incorporated into a fully-enclosed vending machine, equipped with one or more product storage containers, to provide on-demand personalized sublimated products and accessories for a consumer.

A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.

A system for roll-based printing nanowires on a substrate, including a horizontal stage configured to translate along a first horizontal axis, a donor substrate platform coupled to the horizontal stage, a vertical stage configured to translate along a vertical axis and a receiver substrate platform having a cylindrical surface extending from a first end to a second end along a second horizontal axis, the second horizontal axis perpendicular to the first horizontal axis and wherein the receiver substrate platform is rotatably coupled to the vertical stage.

A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.