B41F23/0483

DRYING DEVICE AND INKJET PRINTER SYSTEM INCLUDING DRYING DEVICE
20170165978 · 2017-06-15 · ·

A drying device includes a drying section to dry a recording medium; a cooling section to cool the recording medium conveyed from the drying section; and a duct to expel air inside the drying section to outside the drying device. The duct includes a joint section where the air from the drying section meets air from the cooling section meet. The air from the drying section containing moisture and solvent medium is cooled in the duct.

SHEET DRYING APPARATUS AND IMAGE FORMING SYSTEM PROVIDED THEREWITH

A sheet drying apparatus includes a first conveyance portion, a drying portion, a suction fan, an exhaust portion, first and second ducts, a separation fan, a separation duct, a cooling fan, and a cooling duct. The separation fan separates a sheet from the first conveyance portion at a separation position. The separation duct communicates the separation fan with the separation position. The cooling fan cools the suction fan. The cooling duct communicates the cooling fan with the suction fan. The suction fan and the second duct are arranged downstream of the drying portion. The separation fan, the separation duct, the cooling fan, and the cooling duct are arranged downstream of the suction fan and the second duct. The separation duct and the cooling duct are arranged so that at least parts of them overlap with each other as viewed from the width direction horizontally orthogonal to the conveyance direction.

DEVICE FOR APPLYING HOT ADHESIVE POWDER TO PRINT MEDIA
20260048582 · 2026-02-19 ·

A device for applying hot adhesive powder to print media is constructed as an aluminum frame. The frame forms a support surface similar to a bench on which a printer can be placed. The print medium is conveyed from the printer through a powder unit and to a winding device via deflection rollers.

THERMAL PROCESSING DEVICE AND METHOD
20260101417 · 2026-04-09 ·

A thermal processing device is disclosed herein for thermally processing material on a substrate. The thermal processing device includes a support plate which at a first main side is provided with a layer stack having a free surface for supporting the substrate, wherein the free surface defines a reference plane and which layer stack includes a first resistive heating layer, a second resistive heating layer, and an electrical insulator layer between the first resistive heating layer and the second resistive heating layer. The resistive heating layer each comprise a respective plurality of mutually electrically insulated resistive heating strips that extend in a mutually different directions. Respective pairs of a resistive heating strip of the first plurality and a resistive heating strip of the second plurality overlap in respective areas.