A system and method for selective heating and/or sintering of a material including first and second substrates, an array of one or more resistive heating elements arranged on a planar surface of a substrate and material to be heated located on the other substrate.

An image recording device includes a laser irradiation device that emits laser lights output from a plurality of laser light emitting elements to different positions in a predetermined direction; and an image recording unit that controls the laser irradiation device to irradiate a recording object moving relative to the laser irradiation device in a direction different from the predetermined direction with laser so as to heat the object, form image dots, and record an image. The image recording unit controls the laser irradiation device, conducts recording such that at least one of the image dots, recorded alongside at different positions in a direction perpendicular to a relative moving direction of the object, is shifted relative to other ones of the image dots in the relative moving direction, and records a solid image on the object such that the image dot is partially overlapped with all adjacent image dots.

A laser imaging system and method. In an example embodiment, one or more laser diode arrays are associated with a digital micro-mirror device. A shutter-like device can be positioned upstream in the light path of the laser diode array (or arrays) such that the shutter-like device diverts energy out of the laser imaging system and away from the digital micro-mirror device during periods of extended non-imaging. A homogenizer module can be provided wherein the shutter-like device is located.

A laser imaging system and method. In an example embodiment, one or more laser diode arrays are associated with a digital micro-mirror device. A shutter-like device can be positioned upstream in the light path of the laser diode array (or arrays) such that the shutter-like device diverts energy out of the laser imaging system and away from the digital micro-mirror device during periods of extended non-imaging. A homogenizer module can be provided wherein the shutter-like device is located.

A liquid ejection device that ejects an ultraviolet-curable liquid includes an inkjet head, which is an ejection head that ejects the ultraviolet-curable liquid; a scanning driver that causes the inkjet head to perform a main scan; an ultraviolet generator; and a light source driver; where the ultraviolet generator irradiates the ultraviolet while moving in the main scanning direction together with the inkjet head; the ultraviolet generator includes a plurality of UV LED elements; the plurality of UV LED elements are arranged such that a light emitting range overlaps a range of the nozzle row in a sub scanning direction; and the light source driver drives the plurality of UV LED elements such that an illuminance at an end portion in the sub scanning direction is larger than an illuminance at a central portion in the light emitting range.

A light emitting component includes: plural transfer devices that successively come into ON state; plural setting thyristors that are connected to the plural transfer devices, respectively, and come into a state of being able to shift to ON state by the transfer devices coming into ON state; and plural light emitting devices that are connected to the plural setting thyristors in series, respectively, and emit light or increase in light emission amounts when the setting thyristors come into ON state, and the setting thyristors are formed so as to comprise a voltage reducing layer having a bandgap smaller than bandgaps of light emitting layers of the light emitting devices.

A light emitting component includes: plural transfer devices that successively come into ON state; plural setting thyristors that are connected to the plural transfer devices, respectively, and come into a state of being able to shift to ON state by the transfer devices coming into ON state; and plural light emitting devices that are connected to the plural setting thyristors in series, respectively, and emit light or increase in light emission amounts when the setting thyristors come into ON state, and the setting thyristors are formed so as to comprise a voltage reducing layer having a bandgap smaller than bandgaps of light emitting layers of the light emitting devices.

A light emitting chip including: a substrate that is provided with a first semiconductor laminate part, a tunnel junction layer or a metallic electrically conductive group III-V compound layer, and a second semiconductor layer. The first semiconductor laminate part includes light emitting elements. The tunnel junction layer or the metallic electrically conductive group III-V compound layer is provided on the first semiconductor laminate part. The second semiconductor layer is provided on the tunnel junction layer or the group III-V compound layer, and includes a driving portion. The driving portion includes setting thyristors and drives the light emitting elements to make the light emitting elements be able to shift to an ON state sequentially.

A light emitting chip including: a substrate that is provided with a first semiconductor laminate part, a tunnel junction layer or a metallic electrically conductive group III-V compound layer, and a second semiconductor layer. The first semiconductor laminate part includes light emitting elements. The tunnel junction layer or the metallic electrically conductive group III-V compound layer is provided on the first semiconductor laminate part. The second semiconductor layer is provided on the tunnel junction layer or the group III-V compound layer, and includes a driving portion. The driving portion includes setting thyristors and drives the light emitting elements to make the light emitting elements be able to shift to an ON state sequentially.

There are disclosed methods for producing curable elastomeric compositions comprising carbon black particles, as well as their corresponding cured products. Such compositions, once cured, can be used for the preparation of numerous articles of wide industrial applicability.