The present invention provides a recording head, a recording head adjusting system, and a recording head adjusting method. A recording head includes: a head module having a recording surface; a support member that supports the head module; a first direction position adjusting unit that adjusts the first-direction position of the head module; a rotation direction adjusting unit that adjusts the angular deviation of the rotation direction; and a position detection unit that detects the first-direction position of the head module that is used when performing adjustment by the first direction position adjusting unit and the rotation direction adjusting unit. The rotation direction adjusting unit includes a rotation support mechanism for rotatably supporting the head module within the plane parallel to the recording surface and a second direction moving mechanism for moving the adjustment position of the head module in a second direction perpendicular to the first direction.

An exposure apparatus includes a printed circuit board on which light-emitting chips each having a light-emitting element array are arranged in a staggered manner along a reference line that is parallel to an axial direction of a photosensitive member, and a rod lens array that images light from the light-emitting chips onto a surface of the photosensitive member. The rod lens array is constituted by two rows of lenses. The reference line is equidistant from central lines of the first and second lens rows. A proportion of a width of the light-emitting element array in a circumferential direction of the photosensitive member to a lens diameter is about 0.28, and an interval between the reference line and each light-emitting element array belongs to a range from 0.56 to 0.84 times the lens diameter.

An exposure apparatus includes a printed circuit board on which light-emitting chips each having a light-emitting element array are arranged in a staggered manner along a reference line that is parallel to an axial direction of a photosensitive member, and a rod lens array that images light from the light-emitting chips onto a surface of the photosensitive member. The rod lens array is constituted by two rows of lenses. The reference line is equidistant from central lines of the first and second lens rows. A proportion of a width of the light-emitting element array in a circumferential direction of the photosensitive member to a lens diameter is about 0.28, and an interval between the reference line and each light-emitting element array belongs to a range from 0.56 to 0.84 times the lens diameter.

A lens array comprises a plurality of lenses disposed on a transparent substrate, and a light-shielding film disposed on the transparent substrate around the plurality of lenses, wherein the light-shielding film comprises a cured uv-curable ink containing a thermal acid generator. A method of manufacturing a lens array includes forming a plurality of lenses on a transparent substrate, depositing a uv-curable ink on the transparent substrate around the plurality of lenses, and curing the uv-curable ink to form a light-shielding film disposed on the transparent substrate around the plurality of lenses, wherein the inside of the light-shielding film is heated after the uv-curable ink is cured.

An LED light-emitting module is provided, including a glass substrate, a drive circuit, an LED light-emitting assembly, and a drive chip. The drive circuit is disposed on a side surface of the glass substrate. The LED light-emitting assembly includes a plurality of LED light sources arranged in an array manner. The LED light-emitting assembly is disposed on a surface of the drive circuit and is electrically connected to the drive circuit. The drive chip is connected to the drive circuit, and controls, by using the drive circuit, the LED light source in the LED light-emitting assembly to be turned on or off.

A light emitting device 401 includes a silicon substrate and a light emitting region including a lower electrode, a light emitting layer, and an upper electrode, and an exposure head is provided with a printed board on which light emitting devices 401 are arranged in a staggered form and a circuit portion 602 for controlling, on the basis of image data, a voltage of each of electrodes included in the lower electrode so that the light emitting device layer emits light and is for forming an image with a resolution corresponding to an arrangement interval of the lower electrode with respect to a crossing direction, and the circuit portion 602 is disposed together with the light emitting region on the silicon substrate. Costs on wire bonding and an area of a wiring board can be suppressed.

An image forming device includes a photoconductive body, an exposure unit configured with a plurality of light emitting elements aligned in a predetermined direction, the exposure unit being adopted to expose the photoconductive body to light emitted by the light emitting elements, a frame configured to support both sides of the exposure unit in the predetermined direction, the frame having a reference portion configured to position the exposure unit in the predetermined direction in contact with an end of the exposure unit in the predetermined direction, and a pressing member provided to one of the frame and the exposure unit, the pressing member being configured to press the end of the exposure unit against the reference portion.

An image forming device includes a photoconductive body, an exposure unit configured with a plurality of light emitting elements aligned in a predetermined direction, the exposure unit being adopted to expose the photoconductive body to light emitted by the light emitting elements, a frame configured to support both sides of the exposure unit in the predetermined direction, the frame having a reference portion configured to position the exposure unit in the predetermined direction in contact with an end of the exposure unit in the predetermined direction, and a pressing member provided to one of the frame and the exposure unit, the pressing member being configured to press the end of the exposure unit against the reference portion.

An imaging device for projecting individually controllable laser beams onto an imaging surface movable in an X-direction. The device includes a plurality of semiconductor chips each comprising a plurality of laser beam emitting elements arranged in a main array of M.Math.N. The chips are mounted such that each pair of adjacent chips in the Y-direction are offset from one another in the X-direction and, if activated continuously, the emitted laser beams of the two chips of said pair trace on the imaging surface a set of parallel lines that are substantially uniformly spaced in the Y-direction. In addition to the M.Math.N elements of the main array, each chip comprises at least one additional column on one or each side, each additional column containing at least one selectively operable element capable of compensating for any misalignment in the Y-direction in the relative positioning of the adjacent chips on the support.

A patterning apparatus is provided. The patterning apparatus includes a plurality of liquid jet units arranged in one or more groups and configured to jet an anti-etching liquid onto a surface of a substrate. The patterning apparatus also includes a plurality of exposure units configured to expose light on the anti-etching liquid jetted on the surface of the substrate to heat and cure the jetted anti-etching liquid to form anti-etching patterns on the surface of the substrate. Further, the patterning apparatus includes a control unit configured to control motion status and jetting status of the plurality of liquid jet units and motion status and exposure status of the plurality of exposure units, so as to form the anti-etching patterns at a predetermined line width and thickness.