A device for applying at least a first energy to a substrate includes a conversion material application unit configured to apply a conversion material for converting a second energy to the first energy to the substrate and an energy application unit configured to apply the second energy to the conversion material applied to the substrate, wherein the second energy corresponds to an amount of heat not less than heat of evaporation of the conversion material.

According to an embodiment, a print head includes one or more light emitting element arrays, a light emission control circuit, and one or more drive circuit arrays. The light emitting element arrays include a plurality of light emitting elements arrayed continuously along a main scanning direction. The light emission control circuit outputs drive signals of different phases in units of a light emitting element group configured by a predetermined number of continuous light emitting elements included in the light emitting elements. The drive circuit arrays include a plurality of drive circuits, the drive circuits cause the light emitting elements to emit light individually based on the drive signals.

There is provided a light irradiator including: light sources forming first and second light source rows; a heat sink; a substrate including first and second traces connected to the first and second light source rows, respectively; and a fixing part configured to fix the heat sink to the substrate. The fixing part is arranged between adjacent light sources included in the first light source row and adjacent in the first light source row; and the fixing part is not arranged between adjacent light sources included in the second light source row and adjacent in the second light source row. The first trace includes a first circumventing part configured to circumvent the fixing part; and the second trace includes a second circumventing part configured to circumvent the fixing part and having a directional component different from the first direction.

A printing assembly for thermal transfer printing is disclosed. The assembly comprises at least one first printing system comprising a transfer member having an imaging surface on the front side, a coating station at which a monolayer of thermoplastic particles is applied to the imaging surface, an imaging station at which electromagnetic radiation (EM) is applied, optionally via the rear side of the transfer member, to selected regions of the imaging surface to render the particles coating the selected regions tacky, a transfer station at which only the regions of the particles coating that have been rendered tacky are transferred to a substrate to form an adhesive image; and at least one more downstream printing system. The transfer member includes on its front side an EM radiation absorbing layer, the imaging surface being formed on, or as part of, the absorbing layer, and on its rear side a body which can optionally be transparent to EM radiation.

A printing assembly for thermal transfer printing is disclosed. The assembly comprises at least one first printing system comprising a transfer member having an imaging surface on the front side, a coating station at which a monolayer of thermoplastic particles is applied to the imaging surface, an imaging station at which electromagnetic radiation (EM) is applied, optionally via the rear side of the transfer member, to selected regions of the imaging surface to render the particles coating the selected regions tacky, a transfer station at which only the regions of the particles coating that have been rendered tacky are transferred to a substrate to form an adhesive image; and at least one more downstream printing system. The transfer member includes on its front side an EM radiation absorbing layer, the imaging surface being formed on, or as part of, the absorbing layer, and on its rear side a body which can optionally be transparent to EM radiation.

A light emitting device 401 includes a silicon substrate and a light emitting region including a lower electrode, a light emitting layer, and an upper electrode, and an exposure head is provided with a printed board on which light emitting devices 401 are arranged in a staggered form and a circuit portion 602 for controlling, on the basis of image data, a voltage of each of electrodes included in the lower electrode so that the light emitting device layer emits light and is for forming an image with a resolution corresponding to an arrangement interval of the lower electrode with respect to a crossing direction, and the circuit portion 602 is disposed together with the light emitting region on the silicon substrate. Costs on wire bonding and an area of a wiring board can be suppressed.

Method and system for thermal transfer printing are disclosed. The system comprises a transfer member having an imaging surface on the front side, a coating station at which a monolayer of particles made of, or coated with, a thermoplastic polymer is applied to the imaging surface, an imaging station at which electromagnetic radiation (EM) is applied via the rear side of the transfer member to selected regions of the particles-coated imaging surface to render the particles thereon tacky within the selected regions, and a transfer station at which only the regions of the particles coating that have been rendered tacky are transferred to a substrate. The transfer member includes on its rear side a body transparent to EM radiation and on its front side an EM radiation absorbing layer, the imaging surface being formed on, or as part of, the absorbing layer.

Method and system for thermal transfer printing are disclosed. The system comprises a transfer member having an imaging surface on the front side, a coating station at which a monolayer of particles made of, or coated with, a thermoplastic polymer is applied to the imaging surface, an imaging station at which electromagnetic radiation (EM) is applied via the rear side of the transfer member to selected regions of the particles-coated imaging surface to render the particles thereon tacky within the selected regions, and a transfer station at which only the regions of the particles coating that have been rendered tacky are transferred to a substrate. The transfer member includes on its rear side a body transparent to EM radiation and on its front side an EM radiation absorbing layer, the imaging surface being formed on, or as part of, the absorbing layer.

A recyclable flexible package used for foods, non-foods, pharmaceuticals, and other products that would benefit from flexible packaging solutions is provided. The present invention also relates to the methods of forming recyclable flexible packaging using fewer production steps while using EB cured inks & EB laminates, among others.

An exposure head configured to expose a photosensitive drum includes: a substrate; a plurality of strip-shaped semiconductor chips each including a plurality of light emitting elements that emit light and a drive circuit that drives the light emitting element, the plurality of semiconductor chips being arranged on the substrate; and a lens array configured to collect light from the light emitting elements on the photosensitive drum. The drive circuit operates between a first potential and a second potential, the light emitting element operates between a third potential and a fourth potential, and a potential difference between the third potential and the fourth potential is equal to or larger than a potential difference between the first potential and the second potential.