Systems and techniques for depositing organic material on a substrate are provided, in which one or more shield gas flows prevents contamination of the substrate by the chamber ambient. Thus, multiple layers of the same or different materials may be deposited in a single deposition chamber, without the need for movement between different deposition chambers, and with reduced chance of cross-contamination between layers.

A liquid ejection apparatus, including: a channel structure in which a channel is formed; an actuator stacked on the channel structure in a stacking direction, the actuator configured to cause a liquid in the channel to be ejected; a first frame formed of metal and stacked on the channel structure in the stacking direction; a driver integrated circuit (IC) electrically connected to the actuator; and a second frame formed of metal, the second frame including at least two side walls facing each other and an upper wall extending between the two side walls and extending in a direction orthogonal to the stacking direction, the second frame being thermally connected to the first frame, wherein the driver IC is disposed between the two side walls, and the upper wall of the second frame is thermally connected to the driver IC.

A head unit includes piezoelectric elements configured to be driven in accordance with a drive signal to discharge liquid from nozzles, a protection plate protecting the piezoelectric elements, a head chip including a selection circuit disposed on the protection plate, the selection circuit being configured to select to supply or not to supply the drive signal to the piezoelectric elements, a heat sink, and a thermal conductor coupling the head chip and the heat sink.

A liquid discharge head is provided in which heat of a heat sink is less apt to transfer to a head body. The liquid discharge head includes a head body having a discharge hole for discharging a liquid therethrough, a driver IC configured to control driving of the head body, a casing which is disposed on the head body and has openings on a side surface of the casing, and a heat sink which is disposed on the openings of the casing and configured to dissipate heat generated in the driver IC, and a thermal insulation part disposed between the heat sink and the head body. This makes it possible to reduce the likelihood that the heat of the heat sink transfers to the head body.

A liquid ejection head includes a plurality of pressurizing chambers connected to a plurality of ejection holes, a plurality of first individual flow paths connected to the plurality of pressurizing chambers, a plurality of second individual flow paths and a plurality of third individual flow paths, a first common flow path is connected in common to the plurality of first and plurality of second individual flow paths, and a second common flow path is connected in common to the plurality of third individual flow paths. The first and second individual flow paths are connected to the same pressurizing chamber, the first individual flow path is connected to the first common flow path in an opening end portion, compared to the second individual flow path. The first individual flow path is located opposite to a side where the ejection hole is open outward, compared to the second individual flow path.

A liquid ejection head includes: a first head unit; a second head unit disposed adjacent to the first head unit in a first direction and located on a first side of the first head unit in a second direction; and a heat uniforming unit shared by the first head unit and the second head unit. Each of the first head unit and the second head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. The heat uniforming unit includes a first heat uniforming member disposed on the first side of the first head unit and the second head unit in the second direction. The first heat uniforming member includes a first protrusion located next to the second head unit in the first direction and protruding toward the first head unit.

A liquid discharge head includes a plurality of individual chambers communicating with a plurality of nozzles that discharges a liquid, a common chamber formed by a frame and communicating with the plurality of individual chambers, a temperature detector to detect temperature of the liquid, and a temperature controller connected to the temperature detector, to heat or cool the liquid in the common chamber based on readings from the temperature detector. The temperature detector is disposed opposite the common chamber across the plurality of individual chambers in a direction perpendicular to a direction of liquid discharge from the plurality of nozzles.

There is provided a liquid discharge head which includes a plurality of individual channels, each individual channel including a nozzle and a pressure chamber, an actuator, a supply channel, and a return channel. For each individual channel of the plurality of individual channels, with respect to the nozzle, the return channel and the pressure chamber are disposed at one side in the array direction, and the supply channel is disposed at the other side in the array direction. An end portion of the pressure chamber at the one side in the array direction is positioned between the nozzle and an end portion of the return channel at the one side in the array direction. A center of the return channel in the array direction is positioned between the nozzle and the outlet port.

A liquid ejecting apparatus includes a liquid chamber that communicates with a nozzle, a communication flow path that communicates with the liquid chamber and that has a first opening into which a liquid flows, a discharge flow path that discharges the liquid and that has a second opening into which the liquid flows, a supply flow path capable of supplying the liquid to the communication flow path and the discharge flow path, and a first slide portion disposed between the supply flow path and the communication flow path and having a first through hole that enables the supply flow path to communicate with the communication flow path. The first slide portion, by sliding along the opening surface of the first opening, changes the position of the first through hole with respect to the communication flow path and changes the flow path resistance of the communication flow path.

A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.