Provided is a liquid ejection apparatus capable of cooling a control board of a liquid ejection head without cooling a liquid supply path. Ae liquid ejection unit ejects ink onto paper. Ae control board controls the operation of the liquid ejection unit. Ae head housing covers and houses the control board inside thereof. Ae liquid supply path supplies ink to the liquid ejection head. Ae main body housing covers and houses a portion of the liquid ejection head except for the liquid ejection unit. A fan causes air to flow between the main body housing and the head housing. The liquid supply path is inserted from the outside to the inside of the main body housing in the vicinity of the liquid ejection head, and is connected to the liquid ejection head.

A liquid ejection head having at least one energy generation element for generating heat to be used for ejecting a liquid includes an insulating layer which is provided in contact with a substrate and supports the energy generation element; at least one heat transmitting layer which is composed of a material having a higher thermal conductivity than that of a material of the insulating layer and which is provided, in the insulating layer, between the energy generation element and the substrate; and a heat transmitting member which thermally connects the at least one heat transmitting layer and the substrate, wherein the heat transmitting member is connected to an area, on the heat transmitting layer, excluding an area directly below the energy generation element in a position interposed between the energy generation element and the substrate.

A liquid ejecting apparatus includes a liquid ejecting head including head chips each including a nozzle plate, a holder that is formed of resin, holds the head chips, and includes a flow path for supplying the liquid to each of the head chips, a holder cover that is formed of a material having a higher thermal conductivity than a thermal conductivity of the holder and houses the head chips and the holder, and a fixing plate that is formed of metal and to which the holder cover and the head chips are fixed, a carriage on which the liquid ejecting head is mounted, and a heater that is mounted on the carriage and heats the liquid inside each of the head chips via the holder cover and the fixing plate.

A liquid discharging apparatus has: a head unit that discharges a liquid; and a control unit that controls the operation of the head unit. The head unit has: a driving circuit board that includes a driving signal output circuit that outputs a driving signal, and also includes a substrate on which the driving signal output circuit is mounted; a discharge head that includes a driving element driven by the driving signal, a switching circuit that selectively supplies the driving signal to the driving element, and a nozzle plate in which a nozzle is formed, the nozzle discharging the liquid by being driven by the driving element; a first flow path member through which the liquid to be discharged from the nozzle passes; and a first heat dissipating member coupled to the driving circuit board. The first heat dissipating member is coupled to the first flow path member.

A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.

A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.

A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.

A liquid ejection head includes a nozzle surface having a plurality of nozzles, a channel structure stacked on the nozzle surface in a stacking direction, and a supply channel structure formed of a material having a lower thermal conductivity than a material of the channel structure. The channel structure has a liquid ejection channel communicating with the nozzles. The supply channel structure has a supply channel communicating with the liquid ejection channel. The supply channel structure has a covering portion covering at least a portion of an end surface on a side of the channel structure in a width direction orthogonal to the stacking direction.

There is provided a liquid discharge head including: a nozzle member; a first common channel member including first common channels; an actuator member including pressure chambers and driving elements; a driver IC; a second common channel member including a second common channel; and a chiller configured to chill the driver IC.

A plurality of head chips including: a nozzle plate having a plurality of nozzles configured to eject a liquid in a first direction, and a case having one or more first flow paths communicating with at least a part of the plurality of nozzles; a holder to which the plurality of head chips are fixed, which includes metal or ceramics, and which has a plurality of second flow paths communicating with at least one of the plurality of first flow paths; and a heater configured to heat the holder.