An element substrate of multi-layer structure, comprising an electrothermal transducing element formed in a first layer, a protective film covering the electrothermal transducing element, an anti-cavitation film formed on the protective film, a first electrical wire formed in the same layer as the anti-cavitation film, arranged to be separated from the electrothermal transducing element, and electrically connected to at least one end of the electrothermal transducing element, a second electrical wire on an opposite side, in relation to the electrothermal transducing element, to the protective film, and formed in a second layer, and a first connection member that extends between the first and second layers, and that electrically connects the first and second electrical wires.

A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate.

A droplet ejector assembly for a printhead comprises a substrate, the substrate comprising a CMOS control circuit, a plurality of layers on the first surface of the substrate, a fluid chamber having a droplet ejection outlet, and a piezoelectric actuator element formed by one or more said layers and comprising first and second electrodes in contact with a piezoelectric body. The piezoelectric actuator element defines part of the fluid chamber. At least one said electrode electrically is connected to the CMOS control circuit. The droplet ejector comprises a fluid chamber having a droplet ejection outlet. The piezoelectric actuator element is separate to the droplet ejection outlet and the piezoelectric body is formed of one or more piezoelectric materials processable at a temperature below 450° C. Thus, a CMOS control circuit is integrated with a droplet ejector assembly. The CMOS control circuit may receive both an analogue actuator ejection pulse and serial digital controls signals and use the serial digital control signals to determine which piezoelectric actuator elements are connected to and driven by individual actuator ejection pulses.

The present invention relates to a printing device (1), preferably a 3D printer (1), comprising at least one printing nozzle (3) which is designed to eject a flowable material through at least one ejection opening (32) in the direction of a work surface (11) which is preferably horizontal. The printing device (1) is characterized in that the printing nozzle (3) has a stationary printing nozzle frame (30) and a printing nozzle head (31) with the ejection opening (32), which printing nozzle head (31) can be moved, preferably in the vertical direction (Z), relative to the printing nozzle frame (30), wherein the printing nozzle (3) is designed to move the printing nozzle head (31) relative to the printing nozzle frame (30), preferably in the vertical direction (Z), between an open position, in which a flow of the flowable material through the ejection opening (32) is permitted, and a closed position, in which a flow of the flowable material through the ejection opening (32) is not permitted, by means of a drive, preferably by means of a piezoelectric or pneumatic drive, wherein the ejection opening (32) of the printing nozzle head (31) is spaced apart further from the work surface (11) in the closed position than in the open position.

A printhead including a fluid ejector chip having an electrical interface. The electrical interface includes one or more inputs for receiving respective primitive address data and heater address data corresponding to each of one or more address cycles, at least one of the one or more inputs being switchable to a deactivated state, and one or more shift registers, a total number of shift registers being adjustable so that each of the one or more shift registers corresponds to a respective one of the one or more inputs that is not in a deactivated state, the one or more shift registers receiving the respective primitive address data and heater address data from the one or more inputs that are not in a deactivated state to allow for selective application of electrical signals to the heating elements so that fluid is ejected from the fluid ejector chip in accordance with image data.

A printhead, comprises: a printing element; a first power supply wiring configured to be electrically connected to one terminal of the printing element and supply power to the printing element; a transistor configured to electrically connected to another terminal of the printing element, and drive the printing element; a first ground wiring configured to be electrically connected to a source of the transistor; a second ground wiring configured to be electrically connected to a back gate of the transistor; and a first capacitive element configured to be electrically connected, at one terminal thereof, to the first ground wiring and electrically connected at another terminal thereof, to the second ground wiring.

A plurality of element arrays are formed between a first terminal array and a second terminal array by a plurality of elements. An element array positioned closer to the second terminal array than to the first terminal array is connected to the second terminal array. An element array positioned closer to the first terminal array than to the second terminal array is connected to the first terminal array.

A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.

A wide array printhead module includes a plurality of printhead die, each of the printhead die includes a number of nozzles. The nozzles form a number of primitives. A nozzle firing heater is coupled to each of the nozzles. An application specific integrated circuit (ASIC) controls a number of activation pluses that activate the nozzle firing heaters for each of the nozzles associated with the primitives. The activation pulses are delayed between each of the primitives via internal delays and external delays to reduce peak power demands of the printhead die. The ASIC determines the internal delays within each printhead die.