A liquid ejecting head unit includes an ejecting surface in which nozzles for ejecting a liquid are formed, and a first and a second circuit substrates for ejecting the liquid from the nozzles, in which a planar shape of the ejecting surface includes a first, a second and a third portions. A center line parallel to a long side of a rectangle of a minimum area surrounding the ejecting surface passes the first portion but not the second and third portions. The second and third portions are arranged adjacently to the first portion interposed therebetween. The first circuit substrate is positioned in the first and second portions. The second circuit substrate is positioned in at least one of the first and third portions.

A modular inkjet printhead includes a plurality of printhead modules arranged end on end in a row. Each printhead module includes: a substrate having a plurality of longitudinal ink supply channels; a plurality of print chips mounted on a first face of the substrate, each print chip receiving ink from a respective ink supply channel; and a plurality of fingers extending longitudinally from opposite ends of each printhead module, each finger having an ink port extending away from a second face of the substrate opposite the first face, each ink port being in fluid communication with a respective ink supply channel Each ink supply channel is connected to a respective pair of ink ports at opposite ends of each printhead module and the fingers of neighboring printhead modules are interdigitated such that the ink ports of neighboring printhead modules overlap.

A printhead module includes: a monolithic substrate having alternate longitudinal slots and longitudinal ink supply channels defined through a thickness of the substrate and extending parallel with each other along a length of the substrate; and a plurality of rows of print chips mounted on a front face of the substrate, each row of print chips receiving ink only from a respective one of the ink supply channels. Each one of the longitudinal slots is configured to supply power and data only to a respective one of the rows of print chips.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The at least one inkjet chip is directly formed on the chip substrate by the semiconductor process, and the wafer is diced into the at least one inkjet chip, to be implemented for inkjet printing.

A printhead module for a modular pagewide inkjet printhead. The printhead module has only four rows of print chips configured for printing four different inks, each print chip having multiple nozzle rows for redundant monochrome printing of one respective ink. A print zone of the printhead module has a width of less than 100 mm across the four rows of print chips.

A liquid ejection head circuit board including a substrate, a heat generating resistance element that generates heat energy used for ejection of liquid, an electric wiring layer that is electrically connected to the heat generating resistance element, and an insulating film that insulates the electric wiring layer. The insulating film includes a first insulating film and a second insulating film on the first insulating film, the first insulating film is a first SiOCN film, and the second insulating film is a second SiOCN film containing more carbon than the first SiOCN film or a low-density insulating film with a lower density than the first SiOCN film.

The present invention provides a method for forming a thermal inkjet printhead, comprising at least the following steps: providing a semiconductor wafer including an integrated electronic circuit and a section for forming a thermal actuator element, the integrated circuit comprising at least: a thermal insulating layer formed over a substrate; and a first metal layer formed over the thermal insulating layer; wherein the first metal layer extends into the section for forming the thermal actuator element; and etching a section for forming a thermal actuator element to the first metal layer such that the first metal layer is acting as an etch stop layer. Further there is provided a thermal inkjet printhead formed by a method of the present invention and a semiconductor wafer for forming the thermal inkjet printheads by a method of the present invention.

A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.

A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes A number of field-effect transistors are parallel to the fluid feed holes, where each of the fluidic actuators is powered by an associated field effect transistor. Logic circuitry to actuate the plurality of field-effect transistors is disposed on the die on an opposite side of the fluid feed holes from the field-effect transistors, wherein traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure comprising one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.

A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.