A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

A liquid ejecting head includes an introduction portion for introducing a gas supplied, a discharge portion for discharging the gas, and drive circuits provided in each of head chips, in which the drive circuits include a first drive circuit for driving the first head chip and a second drive circuit for driving the second head chip, a gas path through which the gas flows from the introduction portion to the discharge portion includes a first path coupled to the introduction portion, a second path coupled to the discharge portion, a first branch path coupling the first path and the second path, and a second branch path coupling the first path and the second path so as not to pass through the first branch path, the first drive circuit is disposed in the first branch path, and the second drive circuit is disposed in the second branch path.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by the semiconductor process and formed on the chip substrate. Each ink-drop generator includes a barrier layer, an ink-supply chamber and a nozzle. The ink-supply chamber and the nozzle are integrally formed in the barrier layer.

According to examples, an apparatus may include a substrate having a fluid recirculation channel and a membrane adjacent to the fluid recirculation channel, in which the membrane is portion of the substrate having a smaller thickness than other portions of the substrate. The apparatus may also include a component layer, in which a fluid ejection chamber may be formed in the component layer. The fluid ejection chamber may include a nozzle and fluid may be received into the fluid ejection chamber through an inlet port and recirculated to the fluid recirculation channel through an outlet port. The apparatus may further include active circuit elements formed on the membrane, in which the active circuit elements may control ejection of fluid from the fluid ejection chamber through the nozzle.

In some examples, a fluidic die includes an arrangement of fluidic elements to dispense a fluid, each fluidic element of the fluidic elements including a fluidic actuator and a fluid chamber. An array of fluid feed holes is arranged in a plurality of dimensions to communicate the fluid with the fluidic elements, where each of multiple fluid feed holes along a first dimension of the plurality of dimensions is distinct from multiple fluid feed holes along a second dimension of the plurality of dimensions. The fluidic die includes first circuit elements operable at a first power supply voltage, the first circuit elements interspersed in regions between the fluidic elements along different axes of the fluidic die. The fluidic die includes second circuit elements operable at a second power supply voltage greater than the first power supply voltage, the second circuit elements comprising active devices and placed in a region outside of a boundary defining a space in which the fluidic elements and the first circuit elements are placed.

In some examples, a fluidic die includes an arrangement of fluidic elements to dispense a fluid, where each fluidic element of the fluidic elements includes a fluidic actuator and a fluid chamber. The fluidic die includes an array of fluid feed holes in a plurality of dimensions to communicate the fluid with the fluidic elements, where each of multiple fluid feed holes along a first dimension of the plurality of dimensions is distinct from multiple fluid feed holes along a second dimension of the plurality of dimensions. The fluidic die includes circuit elements interspersed in regions between the fluidic elements along different axes of the fluidic die, where each circuit element of the circuit elements includes an active device. The fluidic elements and the circuit elements are formed on a common substrate.

A printhead module for a modular pagewide inkjet printhead. The printhead module has only four rows of print chips configured for printing four different inks, each print chip having multiple nozzle rows for redundant monochrome printing of one respective ink. A print zone of the printhead module has a width of less than 100 mm across the four rows of print chips.

In an example, a method includes, by logic circuitry associated with a replaceable print apparatus component installed in a print apparatus, responding to a sensor data request received from the print apparatus by returning a first response; receiving a calibration parameter from the print apparatus; and returning a second response which is different from the first response.

An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of first data lines, a second data line, a first memory element, and a second memory element. The first memory element is enabled in response to first data on the plurality of first data lines. The second memory element is enabled in response to second data on the second data line.