The present embodiments relate to a printing apparatus capable of mitigating/preventing instances of turbulent deviation of ink jetted from print heads when printing onto a substrate, a severe form of which looks like woodgrain. The printing apparatus can include a jet plate that has a first width and that is disposed between the substrate and a series of print heads. The jet plate can also include a series of apertures formed in the jet plate that each correspond to one or more of the print heads, as well as a cutout portion at a first end of the jet plate that has a second width less than the first width.

A liquid ejecting apparatus includes a liquid ejecting head and a cap configured to contact on an annular contacting region provided in a fixing plate. The liquid ejecting head includes head chips, each including a nozzle plate, and the fixing plate provided with opening portions for exposing the respective nozzle plates. A first hole and a second hole different from the opening portions are provided in the fixing plate. The fixing plate includes a first surface provided with the contacting region and a second surface to which the head chips are fixed. The opening portions are disposed inside the contacting region in a plan view when viewed in a direction perpendicular to the first surface. Each of the first hole and the second hole is disposed inside the contacting region in the plan view and is blocked by a filler.

There is provided an inkjet recording apparatus including: a plurality of ink ejectors each having a nozzle array in which two or more nozzles each of which ejects ink are one-dimensionally arranged; a support member to which the plurality of ink ejectors are attached at positions different from one another in a predetermined arrangement direction in a state where the nozzle array is oriented in the arrangement direction; and a support member deformer that deforms the support member in a direction in which a deflection of the support member is reduced.

A liquid jetting apparatus jetting a liquid onto a recording medium conveyed in a first direction includes head units arranged in a second direction orthogonal to the first direction. One head unit includes nozzle chips; one nozzle chip has a nozzle arrangement area wherein nozzles are aligned in a third direction crossing the first and second directions. The nozzle chip is arranged to be shifted relative to another nozzle chip in a direction crossing the first and second directions and different from the third direction. The head unit has a first overlapping portion wherein nozzle arrangement areas of first and second nozzle chips included in the nozzle chips partially overlap with each other in the first direction. The liquid jetting apparatus has a second overlapping portion wherein nozzle arrangement areas of third and fourth nozzle chips included in the head units partially overlap with each other in the first direction.

A liquid ejecting unit includes: a first chamber; a second chamber; a third chamber; a fourth chamber; a first liquid passage for supplying a first type of liquid to the first chamber and the third chamber; a second liquid passage for supplying a second type of liquid to the second chamber and the fourth chamber, the second type of liquid differing from the first type of liquid; a first fluid passage for supplying fluid to the first chamber and the second chamber; and a second fluid passage for supplying the fluid to the third chamber and the fourth chamber.

An element substrate is bonded to a support substrate with high positional accuracy. A manufacturing method of the liquid ejecting head includes curing a first adhesive, which is in contact with an element substrate and a support substrate, at a first temperature to perform first temporary fixing, heating a second adhesive, which is in contact with the element substrate and the support substrate, to a second temperature higher than the first temperature so as to cure the second adhesive and perform second temporary fixing and heating a third adhesive, which is in contact with the element substrate and the support substrate, to a third temperature higher than the second temperature so as to cure the third adhesive and bond the element substrate to the support substrate. An elastic modulus of the second adhesive is larger than an elastic modulus of the first adhesive at the second temperature.

A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.

A liquid discharge head includes a recording element substrate including a discharge port. A channel member is configured to supply the recording element substrate with a liquid. An electric wiring board is configured to supply the recording element substrate with power. A plate-like protective member is directly or indirectly fixed to the channel member. In a case where a direction in which the recording element substrate is viewed from the channel member is defined as downward, the protective member includes a first bent portion configured to be bent in a transverse direction of the liquid discharge head. The first bent portion is located at a position that is above an upper end of the channel member and below a midpoint of a line segment connecting the upper end of the channel member and an upper end of the protective member.

A method of operating an electrostatic ink jet printhead, the printhead comprising: one or more ejection tips from which, in use, ink is ejected, the one or more ejection tips defining a tip region; a printhead housing, the printhead housing defining a cavity in which the one or more ejection tips are located; the method comprising the steps of, during a printing operation, passing a vapour into the cavity to reduce evaporation of ink in the tip region.

Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.