The present embodiments relate to a printing apparatus capable of mitigating/preventing instances of turbulent deviation of ink jetted from print heads when printing onto a substrate, a severe form of which looks like woodgrain. The printing apparatus can include a jet plate that has a first width and that is disposed between the substrate and a series of print heads. The jet plate can also include a series of apertures formed in the jet plate that each correspond to one or more of the print heads, as well as a cutout portion at a first end of the jet plate that has a second width less than the first width.

Systems and methods for pre-aligning print head(s) to alignment adapter(s) to increase print resolution of printed matter, and to reduce offline time of a printing system due to print head alignment, include the use of an alignment adapter to which a print head is pre-aligned and which includes precision alignment features which precisely engage cooperating precision alignment features on the print head carriage mounting plate of the print head carriage. Print head(s) can be pre-aligned and fine-tuned to alignment adapter(s) even while the printing system is still in print production. Pre-aligned print head/alignment adapter assemblies can then be quickly mounted on the print head carriage using the cooperating precision alignment features of the adapter and print head carriage mounting plate. Duplicate sets of print head mounting sockets can include print heads aligned at different relative offsets (e.g., half a pixel) to increase the print resolution.

A print-head module for a single-pass inkjet printer contains a housing component with a transverse bracket which extends in the X-direction and on which a number of print heads are arranged which are adjusted positionally with respect to at least one reference position. A load-bearing frame with a supporting device is provided for supporting the load-bearing frame. The housing component is mounted on the load-bearing frame such that it swings about a pendulum axis. Furthermore, a single-pass inkjet printer has at least one print-head module of this type. The inkjet printer contains a frame construction with a support, on which the at least one print-head module is placed by use of the supporting device.

A liquid ejecting head includes a liquid ejecting unit that has a nozzle surface to which the nozzle is open, a base member to which the liquid ejecting unit is fixed, and a cover member that is attached to the base member and on which a laminated member is laminated, in which the cover member has a fixing portion to which the laminated member is fixed and a fragile portion that has lower rigidity than the fixing portion, and is attached to the base member by fixing the fragile portion to the base member.

A liquid jetting apparatus jetting a liquid onto a recording medium conveyed in a first direction includes head units arranged in a second direction orthogonal to the first direction. One head unit includes nozzle chips; one nozzle chip has a nozzle arrangement area wherein nozzles are aligned in a third direction crossing the first and second directions. The nozzle chip is arranged to be shifted relative to another nozzle chip in a direction crossing the first and second directions and different from the third direction. The head unit has a first overlapping portion wherein nozzle arrangement areas of first and second nozzle chips included in the nozzle chips partially overlap with each other in the first direction. The liquid jetting apparatus has a second overlapping portion wherein nozzle arrangement areas of third and fourth nozzle chips included in the head units partially overlap with each other in the first direction.

A head unit includes: nozzle chips which are arranged side by side in a first direction, each of the nozzle chips having a jetting surface and nozzles aligned in a predetermined direction parallel to the jetting surface and crossing both of the first direction and a second direction orthogonal to the first direction; a holder configured to hold the nozzle chips from a side opposite to the jetting surface; and a fixing plate to which the nozzle chips are fixed and which is arranged on a side facing the jetting surface of each of the nozzle chips, wherein the holder has first walls arranged in the second direction so as to sandwich the nozzle chips therebetween; each of the first walls has first projections formed on an end surface thereof facing the fixing plate; and the first projections make contact with the fixing plate.

An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.

An inkjet head includes a head chip and an ink chamber. The head chip has a nozzle substrate provided with nozzles which discharge ink. The ink chamber is located over the head chip. In the ink chamber, the ink to be supplied to the nozzles is stored. The inkjet head is mounted on a mounting member. Between the nozzle substrate and the ink chamber, the inkjet head has a position reference substrate provided with butting parts. The butting parts are butted against the mounting member to position the inkjet head when the inkjet head is mounted on the mounting member.

In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.

A wide array printhead module includes a plurality of printhead die. Each of the printhead die includes a number of sensors to measure properties of a number of elements associated with the printhead die. The wide array printhead module further includes an application specific integrated circuit (ASIC) to command and control each of the printhead die. The ASIC is located off any of the printhead die.