An actuator includes a piezoelectric element, a valve body, a support, a movement mechanism, and a restrictor. The piezoelectric element expands and contracts in an expansion-contraction direction. The valve body is movable in the expansion-contraction direction. The support is fitted around the piezoelectric element to expand and contract in the expansion-contraction direction with an expansion and a contraction of the piezoelectric element. The movement mechanism is coupled to the valve body and coupled to the piezoelectric element via the support. The movement mechanism moves the valve body in accordance with the expansion and the contraction of the piezoelectric element. The movement mechanism includes a fixing portion fixing a relative position of the movement mechanism to the support. The restrictor is fixed to each of the support and the fixing portion to regulate a relative position of the fixing portion to the support.

According to one embodiment, a method for manufacturing an inkjet head includes attaching a piezoelectric body facing the substrate, forming slanting side surfaces on the piezoelectric body, the slanting side surfaces extending between a first surface and a second surface of the piezoelectric body such that first surface has a remaining area that is less that a remaining area of second surface, forming a groove in the piezoelectric body from the first surface towards the second surface, the groove passing through two slanting side surfaces on opposite sides of the piezoelectric body, forming a conductive film on an inner surface of the groove, trimming portions of the conductive film proximate to the first surface and the slanting side surfaces such that the conductive film is separated from the first surface and the slanting side surfaces at outer edges of the groove, and forming an insulating film over the conductive film.

Provided is a silicon substrate processing method including: providing a silicon substrate with a sacrificial layer formed in the form of an island on the front surface thereof, the front surface being a surface on a side where the flow path of an ejection port for ejecting liquid is to be formed, the sacrificial layer having a higher etching rate than the silicon substrate; forming a mask layer on the back surface, the back surface being a surface opposite from the front surface, the mask layer being a layer that does not include an opening at a portion of the back surface opposite from the sacrificial layer; forming a non-penetrating hole from an opening on the back surface of the silicon substrate; and forming a beam on the back surface side by performing anisotropic etching on the silicon substrate in which the non-penetrating hole is formed.

A liquid ejection head includes a recording element board, a support member that supports the recording element board, and includes a first surface having a plurality of first openings that communicate with a first supply port and a second supply port, a second surface contacting a supply member and having a second opening that communicates with a supply path, and a flow path through which the plurality of first openings and the second opening communicate with each other. The support member includes a beam that is provided between the plurality of first openings and extends from the first surface to middle of the flow path, and in an arrangement direction of the plurality of first openings, a length of the second opening is shorter than a sum of lengths of the plurality of first openings and a length of the beam on the first surface.

A flow path unit is formed by laminating a plurality of lamination plates, and has a first damper chamber extending in a manner overlapping with a plurality of pressure chambers with a longitudinal direction in which the plurality of pressure chambers is aligned, seen from an opening side of a plurality of nozzles. The first damper chamber is provided at a height between the pressure chamber and the common liquid chamber, in a height along the laminating direction in which the plurality of lamination plates is laminated, and a first support part is provided inside the first damper chamber.

A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.

In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die.

A method for manufacturing a liquid ejection head includes selectively exposing a first photosensitive resin layer to light, thereby curing the portion of the first photosensitive resin layer defining a flow channel member; forming a second photosensitive resin layer on the first photosensitive resin layer; selectively exposing the second photosensitive resin layer to light, thereby curing the portion of the second photosensitive resin layer defining an ejection opening member; and removing the unexposed portions of the first and the second photosensitive resin layer at one time with a developer. Before removal with the developer, the water absorption W of the intermediate layer, the water absorption W1 of the exposed portion of the first photosensitive resin layer, and the water absorption W2 of the exposed portion of the second photosensitive resin layer satisfy the relationship WW1>W2.

Provided is a liquid ejecting head including a fixing plate which includes a first surface and a second surface on a side opposite to the first surface, a plurality of head units which are fixed to the second surface such that the head units can eject liquid to the first surface side of the fixing plate, and a case member which includes a wall portion that is formed to surround the head units and fixed to the fixing plate and which has a plurality of protrusion portions formed in a part of the wall portion, which is the portion facing the fixing plate.

In one example, a method for fabricating a printhead is described. The method may include applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process. The method may further include applying a passivation layer over the electrical interconnect as a dry film laminate.