The electrohydrodynamic print head includes a nozzle layer with a plurality of nozzles A feed layer is arranged above nozzle layer. It contains feed ducts for feeding ink to the nozzles as well as electrically conducting feed lines for feeding voltages to electrodes at nozzles. The feed layer includes one or more dielectric sublayers, which is/are structured to form the feed ducts and feed lines. Some of the sublayers contain vertical via sections and others contain horizontal interconnect sections. The feed layer is structured for customizing the print head easily.

In a liquid ejecting head, an electrical connection portion between an element substrate and a wiring substrate can be satisfactorily sealed, and a decrease in yield and an increase in manufacturing cost can be suppressed. The liquid ejecting head includes the element substrate having a plurality of energy generating elements and a plurality of electrodes, and the wiring substrate having a plurality of electrode terminals connected to the plurality of electrodes. The element substrate and the wiring substrate are overlapped with each other in a state where the electrode and the electrode terminal face each other, a connection portion is surrounded by a resin layer, and the resin layer is covered with a sealing resin. The resin layer is divided into a plurality of portions by a gap provided in a portion between both end portions of the electrode terminal in an arrangement direction. An inside of the gap is filled with the sealing resin.

A hydrophilic coating material including an alginic acid compound and a resin, in which the alginic acid compound is granulated and dispersed in the resin. In a coating film using the material, it is preferred that the granulated alginic acid compound is exposed on the surface. Such a hydrophilic coating film is suitable as a hydrophilization treatment film of a nozzle face surface of an inkjet recording head.

A liquid ejecting head with a sealing member includes: a liquid ejecting head including a liquid ejecting surface configured to eject ink; a fixing member configured to be attachable to and detachable from the liquid ejecting head; and a sealing member configured to seal the liquid ejecting head and the fixing member. When the liquid ejecting head to which the fixing member is joined is mounted on a cover, the sealing member seals the liquid ejecting head and the cover.

A fluid ejection head for a fluid jet ejection device and a method for improving adhesion between a nozzle plate and a flow feature layer of the ejection head. The fluid ejection head includes a silicon substrate containing at least one array of fluid ejectors deposited thereon. At least one fluid supply via is etched through the silicon substrate adjacent to the at array of fluid ejectors. A flow feature layer is attached to the silicon substrate. The flow feature layer contains at fluid chambers and fluid flow channels corresponding the array of fluid ejectors for ejecting fluid provide fluid from the at least one fluid supply via to fluid chambers. At least a portion of the flow feature layer comprises an attachment surface having improved surface adhesion characteristics, and a nozzle plate containing nozzle holes is laminated to the flow feature layer to provide the fluid ejection head.

A substrate laminated body is formed by joining a first substrate for forming a part of a device and a second substrate for forming another part of the device. The first and second substrates are joined by a method comprising: a temporarily joining step of arranging an adhesive agent outside a device forming region and temporarily joining the device forming regions of the first substrate and the second substrate to be held in a non-contact state, and a finally joining step of forming a film so as to fill a gap between the device forming regions in the non-contact state and finally joining the first substrate and the second substrate by way of the film.

A liquid ejecting head includes a driving substrate including a driving element configured to, in response to a signal from an external controller, expand or contract so that a liquid is discharged from a pressure chamber through a nozzle, and a connection portion connecting the driving element to a wiring substrate connectable to the external controller; a sealing member that covers the connection portion and a part of the wiring substrate; and a mask plate partially covering a part of the driving substrate including the connection portion and contacting the sealing member.

A liquid ejection head includes a substrate provided with an energy-generating element, an ejection orifice forming member that is formed on the substrate and includes an ejection orifice from which liquid is ejected, a reinforcing rib provided in the ejection orifice forming member, and a recess that is formed in the substrate and forms a part of a flow path of liquid, wherein the reinforcing rib is disposed in the inside of the recess.

A manufacturing method of a head leading member, which is provided in a printing machine including a head for discharging an ink toward a working surface, in order to lead the head in a main travelling direction, and the manufacturing method of a head leading member including: a base member fixing step in which a base member, being like a plate, is fixed to a frame extending in the main travelling direction; a guiding reference surface shaping step in which a surface of the base member, in a state of being fixed to the frame, is so manufactured as to be a plane, being along the main travelling direction, in such a way as to shape a guiding reference surface; and a guide member supporting step in which a guide member for leading the head is set in such a way that the guiding reference surface supports the guide member.

A method of manufacturing a liquid ejection head including a first step of having a molten resin becoming a first portion flow in between a first position in a first mold and a first position in a second mold and the molten resin becoming a second portion flow in between a second position in the first mold and a second position in the second mold; a second step of relatively moving the first and second molds, after opening the molds; a third step of closing the molds; a fourth step of joining the first and second portions, a fifth step of taking out the first and second portions and the sealing portion from the molds and mounting a recording element substrate; and a step of forming a space portion between a liquid supply path surface and a mounting surface.