The present invention relates to a method for manufacturing a thermal print head. Dispose a silicon substrate on a carrier, and dispose sequentially a glaze layer, a thermal resistance layer, an electrode pattern layer, and a passivation layer on the silicon substrate for forming a thermal print head. In addition, the size of the silicon substrate disposed on the carrier can be changed according to the opening on the carrier for providing a large-size thermal print head or one-time large-size printing.

The present invention relates to a method for manufacturing a thermal print head. Dispose a silicon substrate on a carrier, and dispose sequentially a glaze layer, a thermal resistance layer, an electrode pattern layer, and a passivation layer on the silicon substrate for forming a thermal print head. In addition, the size of the silicon substrate disposed on the carrier can be changed according to the opening on the carrier for providing a large-size thermal print head or one-time large-size printing.

A method for manufacturing a bonded substrate body in which an end portion of an adhesive is located at a position retreated in a direction to the inside of the bonded substrate body from an end surface of a bonding region of a first substrate and a second substrate includes forming a film on the end portion of the adhesive.

Disclosed is a method for fabricating a fluid ejection device. The method includes forming a drive circuitry layer on a substrate. The method further includes fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and forming at least one fluid feed trench within a bottom portion of the substrate. Each fluid feed trench of the at least one fluid feed trench is in fluid communication with one or more slots of the at least one slot. Additionally, the method includes laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot and the at least one fluid feed trench formed therewithin. Further disclosed is a fluid ejection device fabricated using the aforementioned method.

A method of manufacturing a liquid ejection head includes forming a resist film on a first surface of a light-transmitting support having the first surface and a second surface being a back surface of the first surface; bonding a back side of the surface of the resist film to the support side on a substrate having a through hole so as to block the through hole; exposing the resist film with light transmitted from the second surface to the first surface of the support and forming a portion which is removable with a dissolving liquid and a portion which remains against the dissolving liquid on the resist film; immersing the substrate and the exposed resist film in the dissolving liquid, allowing the dissolving liquid to enter the through hole, and removing the removable portion; and peeling the support from the resist film from which the removable portion has been removed.

There is provided a transfer method for transferring a member formed on a film held on a frame jig to an object including: attaching the member formed on the film to the object in a first direction; and delaminating the film from the object in a second direction intersecting with the first direction, wherein a rigidity of the frame jig in the first direction is higher than that of the frame jig in the second direction.

A liquid discharge head includes a substrate that is provided with a supply passage having an opening; an energy generating element that is disposed on a surface of the substrate; an electric wiring layer; an insulation layer; and a discharge port member that forms a discharge port. The insulation layer has an end portion adjacent to the opening of the supply passage and set back from an edge of the opening of the supply passage toward a side where the energy generating element is disposed. The electric wiring layer includes a plurality of electric wiring layers layered on each other.

A liquid injection head improving electric reliability includes: a substrate including: energy generating elements configured to apply energy for ejection to a liquid, and a substrate upper surface on which terminals respectively connected to electric wirings are provided, an ejection port forming member having: an ejection port forming surface in which the ejection ports for ejecting a liquid are formed, and a back surface on a side opposite to the ejection port forming surface, which is arranged so as to opposite to the substrate upper surface, and a sealant configured to cover connecting portions between the electric wirings and the terminals.

To provide a head leading member with which it is possible to inexpensively lead a head with a high level of accuracy. A head leading member is a head leading member, provided in a printing machine that includes a head to discharge ink toward a working surface, for leading the head in a main travelling direction; and the head leading member comprises; a frame extending in the main travelling direction; a base member fixed to the frame, and having a guiding reference surface that is performed with a manufacture so as to be planar along the main travelling direction, in a state of being fixed to the frame; and a guide member extending in the main travelling direction and being supported on the guiding reference surface of the base member, in order to lead the head in the main travelling direction.

A liquid discharge head includes a recording element substrate including a discharge port configured to discharge a liquid, a pressure generating element configured to pressurize the liquid to discharge the liquid, and an electric connecting portion connected to the pressure generating element through an electric wiring and configured to supply power for driving the pressure generating element to the pressure generating element. The liquid discharge head includes a first recessed portion and a second recessed portion formed in a range from a back surface of a discharge port surface in which the discharge port of the recording element substrate is formed up to the electric connecting portion, and a communicating portion configured to connect a space formed within the first recessed portion and a space formed within the second recessed portion by allowing the first recessed portion and the second recessed portion to communicate with each other.