The method of manufacturing a liquid ejection head according to the invention includes a bonding step, that is, a step of placing a plurality of element substrates on an adhesive layer formed on a bonding surface and heating the adhesive layer to bond the element substrates to a base material. The bonding step is started from one or two of a plurality of bonding regions located at the center portion of the base material in an arrangement direction of the element substrates and then performed toward the bonding regions located at both end portions of the base material.

A method of manufacturing a liquid ejection head including a first step of having a molten resin becoming a first portion flow in between a first position in a first mold and a first position in a second mold and the molten resin becoming a second portion flow in between a second position in the first mold and a second position in the second mold; a second step of relatively moving the first and second molds, after opening the molds; a third step of closing the molds; a fourth step of joining the first and second portions, a fifth step of taking out the first and second portions and the sealing portion from the molds and mounting a recording element substrate; and a step of forming a space portion between a liquid supply path surface and a mounting surface.

In one example, a method for fabricating a printhead is described. The method may include applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process. The method may further include applying a passivation layer over the electrical interconnect as a dry film laminate.

A method of constructing a micro-valve includes providing a substrate for an actuating beam of the micro-valve, the substrate including a first surface and a second surface. The method also includes forming a plurality of constituent layers on the first surface of the actuating beam, including a layer of piezoelectric material. The method also includes removing a portion of the substrate from at least one of the first surface or the second surface to define a cantilevered portion of the actuating beam. The method also includes providing an orifice plate including an orifice. The method also includes providing a valve seat on a surface of the orifice plate, the valve seat having an opening aligned with the orifice. The method also includes attaching the surface of the orifice plate to the second surface via an adhesive such that an overlapping portion of the cantilevered portion overlaps the orifice.

A method of manufacturing a liquid discharging head includes preparing a wafer provided with an element and a discharge port formation member on a front surface of the wafer, forming a recessed portion in a rear surface of the wafer, attaching the rear surface of the wafer and a dicing tape, cutting the wafer along cutting lines to form an element board, and connecting an electric wiring board and a terminal of the element board. The element board includes a discharge port formation member having a discharge port for discharging liquid and includes the element to supply energy to the discharge port for liquid discharge. The recessed portion is formed at a location corresponding to the cutting lines, and an area of a region where the terminal overlaps the recessed portion is smaller than an area of a region where the terminal does not overlap the recessed portion.

A method for producing a silicon substrate comprising a silicon base material; and a wiring formation layer laminated on a base material surface of the silicon base material, and being provided with a wiring member, an electrode member comprising a noble metal, and a close contact member comprising a base metal between the wiring member and the electrode member, wherein the method comprises a step of forming a deposition film by a fluorocarbon gas, in etching of the silicon substrate; and a removal step of removing, by a removal solution, the deposition film formed by the fluorocarbon gas; the removal solution comprises a primary amine and an organic polar solvent; a content of water in the removal solution is 10 mass % or lower; and a content of tetramethylammonium hydroxide in the removal solution is 1 mass % or lower.

A method for processing a silicon substrate includes forming a structure having a bottom surface and a depth of 200 m or more or 300 m or more from a first surface of a silicon substrate, forming a protective film on an inner wall of the structure, and performing plasma etching so as to selectively remove the protective film disposed on the bottom surface of the structure with respect to the protective film disposed on the substantially perpendicular side wall of the structure, wherein the plasma etching is performed under the condition in which plasma with a sheath length at least 10 times the depth when the depth is 200 m or more, or at least 5 time the depth when the depth is 300 m or more, is generated and a mean free path of ions generated in the plasma is longer than the sheath length.

A method for manufacturing a liquid ejection head includes selectively exposing a first photosensitive resin layer to light, thereby curing the portion of the first photosensitive resin layer defining a flow channel member; forming a second photosensitive resin layer on the first photosensitive resin layer; selectively exposing the second photosensitive resin layer to light, thereby curing the portion of the second photosensitive resin layer defining an ejection opening member; and removing the unexposed portions of the first and the second photosensitive resin layer at one time with a developer. Before removal with the developer, the water absorption W of the intermediate layer, the water absorption W1 of the exposed portion of the first photosensitive resin layer, and the water absorption W2 of the exposed portion of the second photosensitive resin layer satisfy the relationship WW1>W2.

A substrate joint body includes a first substrate that has a first surface and a second surface facing away from the first surface and has an opening in the second surface, and a second substrate joined to the second surface with an adhesive agent, and the opening is covered with the second substrate, wherein a recessed portion extending from a position exposed to the opening toward a position facing an opening edge of the opening on the second surface is formed in a third surface of the second substrate such that an adhesive agent protruding from a joint portion between the first substrate and the second substrate reaches a third surface of the second substrate that faces the opening.

In an ink jet recording head including an electric wiring substrate having an electric contact terminal for receiving an electric signal from an ink jet apparatus, an electric wiring tape which electrically connects the electric wiring substrate and a recording element substrate to each other, and an adhesive sheet which fixes the electric wiring substrate and the electric wiring tape to each other, the electric wiring tape and the electric wiring substrate are fixed to each other with the adhesive sheet containing a polyester resin and an epoxy resin.