Provided is a silicon substrate processing method including: providing a silicon substrate with a sacrificial layer formed in the form of an island on the front surface thereof, the front surface being a surface on a side where the flow path of an ejection port for ejecting liquid is to be formed, the sacrificial layer having a higher etching rate than the silicon substrate; forming a mask layer on the back surface, the back surface being a surface opposite from the front surface, the mask layer being a layer that does not include an opening at a portion of the back surface opposite from the sacrificial layer; forming a non-penetrating hole from an opening on the back surface of the silicon substrate; and forming a beam on the back surface side by performing anisotropic etching on the silicon substrate in which the non-penetrating hole is formed.

An ink jet head includes a head substrate, a printed board, and a plurality of flexible substrates connected in parallel to each other between the head substrate and the printed board. The head substrate includes a plurality of ink jet elements, and a common wire extending from an edge of the head substrate and electrically connected to the ink jet elements in common. The printed board includes a reference potential wire through which a reference potential is set to the ink jet head. A first one of the flexible substrates at a first end of an arrangement of the flexible substrates and a second one of the flexible substrates at a second end of the arrangement of the flexible substrates opposite to the first end each has a common connection wire electrically connected between the common wire and the reference potential wire.

A liquid-discharge-head substrate includes a first covering portion covering a first heating resistance element and having electrical conductivity, a second covering portion covering a second heating resistance element and having electrical conductivity, a fuse, and a common wiring line for electrically connecting the first and second covering portions. The common wiring line is electrically connected with the first covering portion via the fuse. The common wiring line and the fuse each have a multilayer structure including a stack of a plurality of conductive layers including a first conductive layer and a second conductive layer that is less oxidizable than the first conductive layer.

In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die.

A flow path unit is formed by laminating a plurality of lamination plates, and has a first damper chamber extending in a manner overlapping with a plurality of pressure chambers with respect to a longitudinal direction in which the plurality of pressure chambers is aligned, as seen from an opening side of a plurality of nozzles. The first damper chamber is provided at a height between the pressure chamber and the common liquid chamber, as measured along the laminating direction in which the plurality of lamination plates is laminated, and a first support part is provided inside the first damper chamber.

A liquid ejection head includes a recording element board, a support member that supports the recording element board, and includes a first surface having a plurality of first openings that communicate with a first supply port and a second supply port, a second surface contacting a supply member and having a second opening that communicates with a supply path, and a flow path through which the plurality of first openings and the second opening communicate with each other. The support member includes a beam that is provided between the plurality of first openings and extends from the first surface to middle of the flow path, and in an arrangement direction of the plurality of first openings, a length of the second opening is shorter than a sum of lengths of the plurality of first openings and a length of the beam on the first surface.

A method for forming a patterned film on a substrate includes: step of patterning a mask material on the substrate, thereby covering, with the mask material, the region except a patterned film forming region on a substrate surface on which the patterned film is to be formed; step of covering, with a protective member, at least a part of the surface of the mask material opposite to the substrate so as to allow the patterned film forming region to communicate with outside air, thereby forming a workpiece to be subjected to film formation in following step; step of forming a film on at least the patterned film forming region of the surface of the workpiece communicating with the outside air; step of releasing the protective member from the mask material; and step of removing the mask material and a part of the film on the mask material.

An object is to provide a laminated substrate, a liquid ejection head, and a method of manufacturing a laminated substrate which are capable of preventing a decrease in the yield of a manufacturing process due to the substrate getting broken and an organic resin material sticking out. To that end, a structure including an eave portion having an overhang with a predetermined length is provided on a predetermined surface of a first substrate so as to form a space between the structure and the predetermined surface, and a resin is filled in the space.

A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.

In some examples, a print bar includes a body, a plurality of printing fluid dispensing devices mounted to the body, and an assembly to carry a printing fluid to the printing fluid dispensing devices. The assembly comprises a first part having outlets to receive the printing fluid from a first conduit, and a second part attached to the first part, the second part having inlets aligned with the outlets of the first part, the second part to carry the printing fluid to the plurality of printing fluid dispensing devices. The assembly further comprises a pliable gasket comprising first and second flat sealing surfaces sealing the first and second parts around a first inlet of the inlets and a first outlet of the outlets, the first flat sealing surface contacting a ridge on one of the first and second parts, and the second flat sealing surface contacting a flat surface on the other of the first and second parts.