A method of producing a deforming tool (2) having a structured embossing surface (4) which can be brought into contact with a surface of a substrate (1) for plastic deformation of the substrate, includes the steps of determining a target structure to be produced on the substrate (1); geometrically distorting the target structure, such that an embossing image structure is obtained; inverting the embossing image structure, such that the embossing structure for the embossed surface (4) is obtained; and producing the embossing surface (4) of the deforming tool (2) according to the embossing structure.

The present disclosure relates to a method for transferring an embossed structure to a surface of a coating composition (B2a), which includes the steps (1-i) and (2-i) or (1-ii) and (2-ii) and also the steps (3) and optionally (4), where the steps (1-i) and (2-i) or (1-ii) and (2-ii) are performed using a composite (F1B1) which is employed as an embossing die (p2) of an embossing tool (P2) and which is composed of a substrate (F1) and of an at least partially embossed and at least partially cured coating (B1), and the coating composition (B1a) used for producing (B1) of the composite (F1B1) is a radiation-curable coating composition of defined constitution. Also described herein is a composite (F1B1).

A method for embossing a first grating in a planar material, by means of an embossing body and a counter embossing body, having each a hard surface, the first grating to be embossed comprising alternating substantially parallel and straight ridges and recesses, whereby the top surfaces of the ridges are intended to weaken a direct angular reflection of light by diffuse omnidirectional reflection, thereby producing a visible contrast between the ridges and the recesses. The method comprises on the embossing body providing a first plurality of obtuse pyramids intended to emboss the recesses of the first grating by exerting pressure on a first side of the planar material, the first plurality of obtuse pyramids forming first intermitted lines (row1, row2) corresponding to the intended recesses, and the pyramids in each subset corresponding to one of the first intermitted lines, being separated from each other by a determined distance that creates a gap in the line in such a manner that each gap from a line of pyramids may be connected to a corresponding gap from an adjacent line of pyramids by an imaginary line perpendicular to both of the adjacent lines; and roughening portions of the hard surface of the embossing body, the portions being located between adjacent lines of pyramids and intersecting at least one of the imaginary lines that connect one gap from one line to the corresponding gap from the adjacent line. On the counter embossing body, the method comprises providing a second plurality of obtuse pyramids intended to emboss the ridges of the first grating by exerting pressure on a second side of the planar material opposite to the first side, during embossing the obtuse summits of the pyramid pressing the planar material against a roughened portion of the hard surface of the embossing body, thereby satirizing the top surfaces of the ridges on the first side.

A graphic arts die assembly includes a die carrier plate, a die, and a die adjuster. The die is adjustably supported on the die carrier plate. The die presents an outer margin and an engraved surface within the outer margin. The die further presents an adjuster surface that extends transversely relative to the engraved surface. The die adjuster shiftably engages the adjuster surface, with shifting movement of the die adjuster causing relative movement between the die and the die carrier plate.

The present invention relates to a door skin comprising an exterior surface having outer portions lying on a first plane, spaced grooves recessed from the plane of the outer portions, and tonal portions having a planar area and a plurality of spaced depressions recessed from the plane of said planar area. The present invention is also directed to a method of etching a plate, for use with a molded die set, for embossing a wood grain pattern in the door skin, and the etched plate formed therefrom.

The present disclosure is drawn to leveling compositions, embossed print media, and methods of preparing embossed print media. The embossed print media can include a media substrate, an image-receiving layer applied to the media substrate at a coating weight of 3 gsm to 50 gsm, and a leveling composition layer. The image-receiving layer can include a pigment filler having an average particle size ranging from 0.1 m to 20 m and a polymeric binder, and in examples herein, is embossed. The leveling composition layer can be applied at a coating weight of 0.2 gsm to 3 gsm to the image-receiving layer, and can include a cationic ionene polymer.

A textured press plate for use in the manufacture of decorative laminate is provided. The textured press plate is manufactured by the method include the steps of applying a UV curable acrylate mixture to a surface of a press plate substrate, irradiating the UV curable acrylate mixture with LED precure by excimer UV to create a UV-irradiated layer having a surface exhibiting micro-folding, and fully curing the UV-irradiated layer to form a textured coating layer.

A door skin featuring a facing having an exterior surface and an interior surface can be provided. A wood grain pattern portion can be formed in the exterior surface of the facing. The wood grain pattern portion can feature a plurality of grooves formed in the exterior surface of the facing, the grooves are recessed from a first plane of the exterior surface, and tonal portions formed in the exterior surface of the facing. The tonal portions can include at least a first protrusion, a second protrusion, and a third protrusion. Spacing between the first protrusion and the second protrusion can be different from spacing between the second protrusion and the third protrusion.

A method for manufacturing structured press elements comprises at least the following steps: the step of providing an element of metal; the step of providing a mask on a surface of the element for shielding portions of the surface; the step of treating non-shielded portions of the surface of the element; the step of removing the mask; wherein the method comprises at least a step in which the surface of the element is subjected to an ultrasonic treatment and/or that the step of providing the mask comprises at least a treatment with infrared radiation and/or that the step of chemically treating is performed with the surface directed downward.

The present disclosure is drawn to leveling compositions, which can include from 80 wt % to 95 wt % water, from 0.5 wt % to 15 wt % organic solvent, and from 0.2 wt % to 6 wt % surfactant. The leveling compositions can further include from 1 wt % to 10 wt % cationic ionene polymer having a weight average molecular weight from 100 Mw to 8000 Mw, and from 1 wt % to 10 wt % polymeric binder.