A method of laying up a segment on a layup surface using a layup head that is mobile with respect to the layup surface, the layup head supporting a spool of a tape of material which includes at least one layer to be laid up from which said segment is cut and at least one interliner, the method including applying the tape of material against the layup surface and removing the interliner using a separator. The tape of material is pressed firmly by a press roller against the layup surface before the interliner is removed as the layup head moves in an advancing movement. A layup head for implementing the method and a layup machine including the layup head are also described.

An improved protected graphics assembly according to the invention comprises the following sequential layers: optionally, at least one adhesive layer; at least one graphics layer; and at least one outwardly exposed polymer layer that is essentially free of low surface energy materials and has a gloss value of greater than 90 when tested according to ASTM D2457-03 at a 60-degree angle. The assembly is beneficially applied to a variety of articles and used in a variety of related methods. In an exemplary embodiment, a race car comprises a protected graphics assembly that comprises: optionally, at least one adhesive layer; at least one outwardly exposed polymer layer that is essentially free of low surface energy materials; and at least one graphics layer substantially protected from exterior exposure by the polymer layer.

A method for use with multiple chips, each respectively having a bonding surface including electrical contacts and a surface on a side opposite the bonding surface involves bringing a hardenable material located on a body into contact with the multiple chips, hardening the hardenable material so as to constrain at least a portion of each of the multiple chips, moving the multiple chips from a first location to a second location, applying a force to the body such that the hardened, hardenable material will uniformly transfer a vertical force, applied to the body, to the chips so as to bring, under pressure, a bonding surface of each individual chip into contact with a bonding surface of an element to which the individual chips will be bonded, at the second location, without causing damage to the individual chips, element, or bonding surface.

An improved protected graphics assembly according to the invention comprises the following sequential layers: optionally, at least one adhesive layer; at least one graphics layer; and at least one outwardly exposed polymer layer that is essentially free of high surface energy materials and has a gloss value of greater than 90 when tested according to ASTM D2457-03 at a 60-degree angle. The assembly is beneficially applied to a variety of articles and used in a variety of related methods. In an exemplary embodiment, a race car comprises a protected graphics assembly that comprises: optionally, at least one adhesive layer; at least one outwardly exposed polymer layer that is essentially free of high surface energy materials; and at least one graphics layer substantially protected from exterior exposure by the polymer layer.

A vehicle is provided that includes a vehicle surface and a vehicle applique in direct contact with the vehicle surface. The applique includes a polymeric substrate and an over-mold positioned on the substrate. The over-mold comprises a diffraction grating integral with the over-mold, the grating having a thickness from about 250 nm to 1000 nm and a period from 50 nm to 5 microns.

Forms that can be used to make stickers easily on demand, wherein the stickers are of the type in which a face of the sticker that bears printed information (graphic, textual, bar code, security, and/or other) also bears an adhesive that is used to affix the sticker to a desired substrate. A carrier sheet supports a sticker body and an adhesive source. The sticker body and the adhesive are initially separated on the form. The sticker face and the adhesive are registrably positioned with respect to a fold line. This allows the adhesive to be transferred to the sticker face on demand by an easy, desirably manual process that involves folding the form along the fold line. When the form is unfolded, the sticker can be removed and applied to the desired substrate.

In a method for printing a metal-tone printed matter, a metallic ink which includes metal particles dispersed in a solvent is applied onto a smooth printing surface of a printing medium to provide a metallic ink layer containing a metal layer having the metal particles accumulated on a printing surface side closer to the smooth printing surface in the metallic ink layer. The printing medium is reversed to transfer the metallic ink layer onto a material to be transferred while making a smooth surface of the metal layer as a display surface.

The method for producing a electroconductive sheet having a substrate, in particular made of paper, and an electroconductive layer include the steps of: a/ preparing a multi-layer structure with an anti-adhesive coating inserted between a plastic film and a base layer, b/ cross-laminating the multi-layer structure and the substrate, and c/ removing the plastic film and the anti-adhesive coating from the base layer. The base layer is a layer of an electroconductive material or is covered with an electroconductive layer by an additional step consisting of: d1/ depositing an electroconductive film on the base layer; or d2/ printing the base layer with at least one ink having electrical properties, with the base layer being a printable layer with a binder base of which the rate is 15% greater in dry weight in relation to the total dry matter weight of this layer.

A method and apparatus of fabrication of a multilayer flexible metamaterial can be fabricated using flip chip transfer (FCT) technique. This technique is different from other similar techniques such as metal lift off process, which fabricates the nanostructures directly onto the flexible substrate or nanometer printing technique. It is a solution-free FCT technique using double-side optical adhesive as the intermediate transfer layer and a tri-layer metamaterial nanostructures on a rigid substrate can be transferred onto adhesive first. Another embodiment of the present invention is the fabrication method and apparatus that allows the transfer of the metamaterial from a rigid substrate such as glass, quartz and metals onto a flexible substrate such as plastic or polymer film. Thus, a flexible metamaterial can be fabricated independent of the original substrate used.

A carrying case for a portable electronic device is disclosed. Generally speaking, the protective case for a portable electronic device comprises a body section having a back surface and upturned sides, and a rim affixed to an edge of the upturned sides of the body sections, the rim defining an open area. Preferably, the body section is comprised of contrasting colors and forms a cavity defined by the back surface and the upturned sides. Further, the body section and the rim are preferably formed of the same material. A second protective section may be used to form a protective shell-like structure about the electronic device.