H10F19/80

Coating composition, coating film, laminate and process for manufacturing the laminate

Provided is a coating composition excellent in antifouling properties, transparency and hydrophilicity, wherein the coating composition contains (A) a metal oxide particle having a number average particle size of 1 nm to 400 nm; and (B) a polymer particle, in which the content of an aqueous-phase component in the component (B), represented by the expression (I), is 20 mass % or less, where (I) (%)=(dry mass of a filtrate obtained by filtering the component (B) at a molecular cutoff of 50,000)(100total mass of solid content)/(mass of the filtratedry mass of the filtrate)100/the total mass of solid content.

SURFACE MOUNT SOLAR CELL WITH INTEGRATED COVERGLASS

Photovoltaic cells, methods for fabricating surface mount multijunction photovoltaic cells, methods for assembling solar panels, and solar panels comprising photovoltaic cells are disclosed. The surface mount multijunction photovoltaic cells include through-wafer-vias for interconnecting the front surface epitaxial layer to a contact pad on the back surface. The through-wafer-vias are formed using a wet etch process that removes semiconductor materials non-selectively without major differences in etch rates between heteroepitaxial III-V semiconductor layers.

Encapsulation layer thickness regulation in light emitting device
09831473 · 2017-11-28 · ·

An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.

Flexible solar panel module, an installated structure thereof and method for fabricating the same

A flexible solar panel module is provided having a plurality of non-flexible solar panels, a plurality of non-flexible covers and a flexible back sheet. Each of the non-flexible solar panels has a photoreactive device layer, a positive ribbon and a negative ribbon. The non-flexible covers correspond to the non-flexible solar panels respectively and are disposed on front surfaces of the non-flexible solar panels. Each of the non-flexible covers is bigger in size than each of the non-flexible solar panels. The flexible back sheet is disposed under back surfaces of the non-flexible solar panels and has a plurality of openings therein. A first water-resistant sealant is disposed between adjacent non-flexible covers and physically contacts the flexible back sheet. A second water-resistant sealant is disposed between the non-flexible covers and the flexible back sheet and covers sidewalls of the non-flexible solar panels. The non-flexible solar panels are laminated with the flexible back sheet and regions between adjacent non-flexible solar panels are flexible/bendable regions of the flexible solar panel module.

Solar cell with reduced absorber thickness and reduced back surface recombination

Manufacture for an improved stacked-layered thin film solar cell. Solar cell has reduced absorber thickness and an improved back contact for Copper Indium Gallium Selenide solar cells. The back contact provides improved reflectance particularly for infrared wavelengths while still maintaining ohmic contact to the semiconductor absorber. This reflectance is achieved by producing a back contact having a highly reflecting metal separated from an absorbing layer with a dielectric layer.

Encapsulant film

Embodiments of the present application relate to an encapsulant film, a method for manufacturing an encapsulant film, an optoelectronic device, and a method for manufacturing an optoelectronic device, and can provide superior adhesive force with a front substrate and a back sheet, and specifically having long-term adhesive and heat resistance properties. Also, the present application can provide the encapsulant which does not have a negative effect on parts, such as optoelectronic elements or wire electrodes encapsulated in the optoelectronic devices, and on a working environment, and which can maintain superior workability and economic feasibility in device manufacturing.

Photovoltaic cell, method for forming same, and photovoltaic module

A photovoltaic cell is provided, including a substrate; a marked region on a surface of the substrate, configured to mark product information of the photovoltaic cell; a first texture structure in the marked region on the surface of the substrate, including at least one first protrusion structure and at least one second protrusion structure, a respective first protrusion structure of the at least one first protrusion structure has a recessed top surface recessing toward a bottom surface of the respective first protrusion structure, and a respective second protrusion structure of the at least one second protrusion structure includes a pyramid structure; and a second texture structure disposed on a part of the surface of the substrate outside the marked region, where the second texture structure includes at least one third protrusion structure, and a respective third protrusion structure of the at least one third protrusion structure includes a pyramid structure.

Photovoltaic cell, method for forming same, and photovoltaic module

A photovoltaic cell is provided, including a substrate; a marked region on a surface of the substrate, configured to mark product information of the photovoltaic cell; a first texture structure in the marked region on the surface of the substrate, including at least one first protrusion structure and at least one second protrusion structure, a respective first protrusion structure of the at least one first protrusion structure has a recessed top surface recessing toward a bottom surface of the respective first protrusion structure, and a respective second protrusion structure of the at least one second protrusion structure includes a pyramid structure; and a second texture structure disposed on a part of the surface of the substrate outside the marked region, where the second texture structure includes at least one third protrusion structure, and a respective third protrusion structure of the at least one third protrusion structure includes a pyramid structure.

Half-cell photovoltaic modules
12218264 · 2025-02-04 · ·

The present invention relates a photovoltaic module comprising 126, 138 or 150 back-contact half-cells. In an embodiment, the half-cells are divided into 3 groups of each 2 parallel strings with each string containing of the total number of half-cells. The module comprises an additional row of 6 back-contact half-cells, relative to known half-cell modules.

PHOTOVOLTAIC MODULE

A PV module includes a transparent substrate, a first solar cell unit, a crystalline silicon solar cell, and a spacer. The first solar cell unit is between the transparent substrate and the crystalline silicon solar cell, and the first solar cell unit includes a first electrode, a second electrode, and a I-III-VI semiconductor layer between the first electrode and the second electrode. The I-III-VI semiconductor layer includes at least gallium (Ga) and sulfur (S), and the energy gap thereof is more than that of crystalline silicon. Moreover, the crystalline silicon solar cell and the first solar cell unit are separated by the spacer.